SCDS260F March   2009  – December 2021 TS3A27518E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 3.3-V Supply
    6. 6.6 Electrical Characteristics for 2.5-V Supply
    7. 6.7 Electrical Characteristics for 1.8-V Supply
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirement
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC (1)TS3A27518EUNIT
PW
(TSSOP)		RTW (WQFN)ZQS (BGA MICROSTAR JUNIOR)
24 PINS24 PINS24 PINS
RθJAJunction-to-ambient thermal resistance10440.7155.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance51.642.969.9°C/W
RθJBJunction-to-board thermal resistance57.519.294.6°C/W
ψJTJunction-to-top characterization parameter9.919°C/W
ψJBJunction-to-board characterization parameter57.119.392.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—8—°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.