SCDS260F March   2009  – December 2021 TS3A27518E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 3.3-V Supply
    6. 6.6 Electrical Characteristics for 2.5-V Supply
    7. 6.7 Electrical Characteristics for 1.8-V Supply
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirement
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics for 2.5-V Supply

VCC = 2.3 V to 2.7 V, TA = –40°C to +85°C (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ANALOG SWITCH
VCOM,
VNO, VNC		Analog signal voltage0

3.6

V
ronON-state
resistance		VCC = 2.3 V0 ≤ (VNC or VNO) ≤ VCC,
ICOM = –32 mA		Switch ON,
see Figure 7-1		TA = 25°C5.59.6Ω
TA = –40°C to +85°C11.5
ΔronON-state
resistance match
between channels		VCC = 2.3 VVNC or VNO = 1.6 V,
ICOM = –32 mA		Switch ON,
see Figure 7-1		TA = 25°C0.30.8Ω
TA = –40°C to +85°C0.9
ron(flat)ON-state
resistance
flatness		VCC = 2.3 V0 ≤ (VNC or VNO) ≤ VCC,
ICOM = –32 mA		Switch ON,
see Figure 7-2		TA = 25°C0.912.2Ω
TA = –40°C to +85°C2.3
INC(OFF),
INO(OFF)		NC, NO
OFF leakage
current		VCC = 2.7 VVNC or VNO = 0.5 V,
VCOM = 2.3 V,
or
VNC or VNO = 2.3 V,
VCOM = 0.5 V		Switch OFF,
see Figure 7-2		TA = 25°C–0.30.040.3μA
TA = –40°C to +85°C–66
INC(PWROFF),
INO(PWROFF)		VCC = 0 VVNC or VNO = 0 to 2.7 V,
VCOM =2.7 V to 0,
or
VNC or VNO = 2.7 V to 0,
VCOM = 0 to 2.7 V		TA = 25°C–0.60.020.6
TA = –40°C to +85°C–1010
ICOM(OFF)COM
OFF leakage
current		VCC = 2.7 VVNC or VNO = 0.5 V,
VCOM = 2.3 V,
or
VNC or VNO = 2.3 V,
VCOM = 0.5 V		Switch OFF,
see Figure 7-2		TA = 25°C–0.70.020.7μA
TA = –40°C to +85°C–11
ICOM(PWROFF)VCC = 0 VVNC or VNO = 2.7 V to 0,
VCOM = 0 to 2.7 V,
or
VNC or VNO = 0 to 2.7 V,
VCOM = 2.7 V to 0		TA = 25°C–0.70.020.7
TA = –40°C to +85°C–7.27.2
INO(ON)
INC(ON)		NC, NO
ON leakage
current		VCC = 2.7 VVNC or VNO = 0.5 V or 2.3 V,
VCOM = open		Switch ON,
see Figure 7-3		TA = 25°C–2.10.032.1μA
TA = –40°C to +85°C–66
ICOM(ON)COM
ON leakage
current		VCC = 2.7 VVNC or VNO = open,
VCOM = 0.5 V,
or
VNC or VNO = open,
VCOM = 2.3 V		Switch ON,
see Figure 7-3		TA = 25°C–20.022μA
TA = –40°C to +85°C–5.75.7
DIGITAL CONTROL INPUTS (IN1, IN2, EN) (1)
VIHInput logic highVCC = 2.7 VVI = VCC or GNDTA = –40°C to +85°C1.153.6V
VILInput logic lowVCC = 2.7 V00.55V
IIH, IILInput leakage currentVCC = 2.7 VVI = VCC or 0TA = 25°C–0.10.010.1μA
TA = –40°C to +85°C–2.12.1
DYNAMIC
tONTurnon timeVCC = 2.5 VVCOM = VCC,
RL = 50 Ω		CL = 35 pF,
see Figure 7-5		TA = 25°C17.236.8ns
VCC = 2.3 V to 2.7 VTA = –40°C to +85°C42.5
tOFFTurnoff timeVCC = 2.5 VVCOM = VCC,
RL = 50 Ω		CL = 35 pF,
see Figure 7-5		TA = 25°C17.129.8ns
VCC = 2.3 V to 2.7 VTA = –40°C to +85°C34.4
tBBMBreak-before-
make time		VCC = 2.5 VVNC = VNO = VCC/2,
RL = 50 Ω		CL = 35 pF,
see Figure 7-6		TA = 25°C4.51330ns
VCC = 2.3 V to 2.7 VTA = –40°C to +85°C33.3
QCCharge injectionVCC = 2.5 VVGEN = 0,
RGEN = 0		CL = 0.1 nF,
see Figure 7-10		0.47pC
CNC(OFF),
CNO(OFF)		NC, NO
OFF capacitance		VCC = 2.5 VVNC or VNO = VCC or GND,
switch OFF		See Figure 7-413.5pF
CCOM(OFF)COM
OFF capacitance		VCC = 2.5 VVNC or VNO = VCC or GND,
switch OFF		See Figure 7-4TA = –40°C to +85°C9pF
CNC(ON),
CNO(ON)		NC, NO
ON capacitance		VCC = 2.5 VVNC or VNO = VCC or GND,
switch OFF		See Figure 7-422pF
CCOM(ON)COM
ON capacitance		VCC = 2.5 VVCOM = VCC or GND,
switch ON		See Figure 7-422pF
CIDigital input capacitanceVCC = 2.5 VVI = VCC or GNDSee Figure 7-42pF
BWBandwidthVCC = 2.5 VRL = 50 ΩSwitch ON,
see Figure 7-6		240MHz
OISOOFF isolationVCC = 2.5 VRL = 50 Ω,
f = 10 MHz		Switch OFF,
see Figure 7-8		–62dB
XTALKCrosstalkVCC = 2.5 VRL = 50 Ω,
f = 10 MHz		Switch ON,
see Figure 7-9		–62dB
XTALK(ADJ)Crosstalk adjacentVCC = 2.5 VRL = 50 Ω,
f = 10 MHz		Switch ON,
see Figure 7-9		–71dB
THDTotal harmonic distortionVCC = 2.5 VRL = 600 Ω,
CL = 50 pF		f = 20 Hz to 20 kHz,
see Figure 7-11		0.06%
SUPPLY
ICCPositive
supply current		VCC = 2.7 VVI = VCC or GNDSwitch ON or OFFTA = 25°C0.010.1μA
TA = –40°C to +85°C2
(1) All unused digital inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.