SCDS260F March   2009  – December 2021 TS3A27518E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 3.3-V Supply
    6. 6.6 Electrical Characteristics for 2.5-V Supply
    7. 6.7 Electrical Characteristics for 1.8-V Supply
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirement
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Parameter Measurement Information

Table 7-1 Parameter Description
DESCRIPTION
VCOM Voltage at COM.
VNC Voltage at NC.
VNO Voltage at NO.
ron Resistance between COM and NC or NO ports when the channel is ON.
Δron Difference of ron between channels in a specific device.
ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions.
INC(OFF) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state.
INC(ON) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output (COM) open.
INO(OFF) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state.
INO(ON) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output (COM) open.
ICOM(OFF) Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the OFF state.
ICOM(ON) Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the ON state and the output (NC or NO) open.
VIH Minimum input voltage for logic high for the control input (IN, EN).
VIL Maximum input voltage for logic low for the control input (IN, EN).
VI Voltage at the control input (IN, EN).
IIH, IIL Leakage current measured at the control input (IN, EN).
tON Turnon time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (NC or NO) signal when the switch is turning ON.
tOFF Turnoff time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (NC or NO) signal when the switch is turning OFF.
QC Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC or NO) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input. Charge injection, QC = CL × ΔVCOM, CL is the load capacitance, and ΔVCOM is the change in analog output voltage.
CNC(OFF) Capacitance at the NC port when the corresponding channel (NC to COM) is OFF.
CNC(ON) Capacitance at the NC port when the corresponding channel (NC to COM) is ON.
CNO(OFF) Capacitance at the NC port when the corresponding channel (NO to COM) is OFF.
CNO(ON) Capacitance at the NC port when the corresponding channel (NO to COM) is ON.
CCOM(OFF) Capacitance at the COM port when the corresponding channel (COM to NC) is OFF.
CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NC) is ON.
CI Capacitance of control input (IN, EN).
OISO OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific frequency, with the corresponding channel (NC to COM) in the OFF state.
XTALK Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC1 to NO1). Adjacent crosstalk is a measure of unwanted signal coupling from an ON channel to an adjacent ON channel (NC1 to NC2). This is measured in a specific frequency and in dB.
BW Bandwidth of the switch. This is the frequency in which the gain of an ON channel is –3 dB below the DC gain.
THD Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental harmonic.
ICC Static power-supply current with the control (IN) pin at VCC or GND.
GUID-5795C267-BAA8-4D82-83D0-9765172A9BB2-low.gifFigure 7-1 ON-State Resistance (rON)
GUID-6FD614D5-190F-4A77-A845-8F0D8B937D38-low.gifFigure 7-3 ON-State Leakage Current (ICOM(ON), INC(ON))
GUID-5C989CE5-9A1E-4F52-AF1F-1DD1119B834E-low.gif
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
CL includes probe and jig capacitance.
Figure 7-5 Turnon (tON) and Turnoff Time (tOFF)
GUID-58556066-2FC2-4446-99F2-FCF0EBAF6A09-low.gifFigure 7-7 Bandwidth (BW)
GUID-4D2CEED7-1491-4B98-8A05-461F03AD952C-low.gifFigure 7-9 Crosstalk (XTALK)
GUID-FC021CD9-0FC8-4425-A151-245A1EE90172-low.gif
CL includes probe and jig capacitance.
Figure 7-11 Total Harmonic Distortion (THD)
GUID-ED862979-D587-450F-8AAC-955AFD25D2E5-low.gifFigure 7-2 OFF-State Leakage Current (ICOM(OFF), INC(OFF), ICOM(PWROFF), INC(PWROFF))
GUID-D5595127-A859-466C-A57E-37E791571C59-low.gifFigure 7-4 Capacitance (CI, CCOM(OFF), CCOM(ON), CNC(OFF), CNC(ON))
GUID-9AFA5C5E-0138-4A50-A9F2-19798F6B6A6B-low.gif
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
Figure 7-6 Break-Before-Make Time (tBBM)
GUID-945C298A-959C-41C1-B291-ED821ADFFEC6-low.gifFigure 7-8 OFF Isolation (OISO)
GUID-10DCBC8D-AADB-457D-8318-2A4D941E865B-low.gif
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
CL includes probe and jig capacitance.
Figure 7-10 Charge Injection (QC)