SCDS371E January   2018  – April 2019 TS5MP646

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified D-PHY Schematic
      2.      Simplified C-PHY Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Powered-Off Protection
      2. 8.3.2 1.8-V Logic Compatible Inputs
      3. 8.3.3 Low Power Disable Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Functions
      2. 8.4.2 Low Power Disable Mode
      3. 8.4.3 Switch Enabled Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 MIPI D-PHY Application
        2. 9.2.3.2 MIPI C-PHY Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

The TS5MP646 can be properly operated without any external components. However, TI recommends that unused I/O signal pins be connected to ground through a 50 Ω resistor to prevent signal reflections and maintain device performance. The NC pins of the device do not require any external connections or terminations and have no connection to the rest of the device internally.

The clock and data lanes can be interchanged as necessary to facilitate the best layout possible for the application. For example, the clock can be placed on the D1 channel and a data lane can be used on the CLK channel if this improves the layout. In addition, the signal lines of the TS5MP646 are routed single ended on the chip die. This makes the device suitable for both differential and single-ended high-speed systems.