SCES955 September   2023 TXH0137D-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Resistive Load Drive
      2. 6.4.2 ON State Input Current
      3. 6.4.3 High-Drive Outputs
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 TTL and other Logic Inputs
        2. 7.2.2.2 High-Impedance Input Drivers
        3. 7.2.2.3 Output Low Voltage
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 Improving Package Thermal Performance
  9. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Option Addendum
    2. 9.2 Tape and Reel Information
    3. 9.3 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|14
Thermal pad, mechanical data (Package|Pins)

7.4.3 Thermal Considerations

Use Equation 4 to calculate TXH0137D-Q1 on-chip power dissipation PD:

Equation 4. P D   =   ∑ i   =   1 N V O L i   ×   I L i

where

  • N is the number of channels active together
  • VOLi is the OUTi pin voltage for the load current ILi.

For reliability of TXH0137D-Q1 and the system, the on-chip power dissipation must be lower than or equal to the maximum allowable power dissipation (PD(MAX)). Equation 5 shows how PD(MAX) is calculated.

Equation 5. P D ( M A X ) =   T J ( M A X ) - T A θ J A

where

  • TJ(MAX) is the target maximum junction temperature
  • TA is the operating ambient temperature
  • θJA is the package junction to ambient thermal resistance

It is recommended to limit the TXH0137D-Q1 IC’s die junction temperature to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation.