SCES861E June 2015 – April 2024 TXS0108E-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TXS0108E-Q1 | UNIT | ||
---|---|---|---|---|
PW (TSSOP) | RKS (VQFN) | |||
20 PINS | 20 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 101.5 | 54.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 35.9 | 54.2 | |
RθJB | Junction-to-board thermal resistance | 52.4 | 27.8 | |
ψJT | Junction-to-top characterization parameter | 2.3 | 2.9 | |
ψJB | Junction-to-board characterization parameter | 51.9 | 27.7 | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | 11.5 |