SCES959A December   2023  – April 2024 TXV0108

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2 ± 0.06 V
    7. 5.7  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    8. 5.8  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    9. 5.9  Switching Characteristics, VCCA = 3.3 ± 0.3 V
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 VCC Isolation and VCC Disconnect (Ioff-float)
      4. 7.3.4 Over-Voltage Tolerant Inputs
      5. 7.3.5 Negative Clamping Diodes
      6. 7.3.6 Fully Configurable Dual-Rail Design
      7. 7.3.7 Supports Timing Sensitive Translation
      8. 7.3.8 Integrated Damping Resistor and Impedance Matching
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Solving Power Sequencing Challenges with the TXV0108
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGY|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2 Detailed Design Procedure

To begin the design process, determine the following:

  • Input voltage range:
    • Use the supply voltage of the device that is driving the TXV0108 device to determine the input voltage range. For a valid logic-high, the value must exceed the positive-going input-threshold voltage (Vt+) of the input port. For a valid logic low the value must be less than the negative-going input-threshold voltage (Vt-) of the input port.
  • Output voltage range:
    • Use the supply voltage of the device that the TXV0108 device is driving to determine the output voltage range.
  • RGMII timing:
    • For the TXV0108 to meet RGMII timing specifications, parameters like frequency, CLOAD and input rise/fall transition have to be met. Ensure each channel does not exceed a maximum frequency of 125MHz, use a CLOAD no greater than 5pF, and use an input rise/fall slew rate no greater than 2ns/V.