SCAS671B October   2001  – January 2022 CDCVF25081

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Phase-locked loop based, zero-delay buffer
    • 1 clock input to 2 banks of 4 outputs
    • No external RC network required
  • Supply voltage: 3 V to 3.6 V
  • Operating frequency: 8 MHz to 200 MHz
  • Low additive jitter (cycle-cycle): ±100 ps for
    66 MHz to 200 MHz
  • Power-down mode available
    • Current consumption: < 20 µA in

      Power-down mode

  • 25-Ω on-chip series damping resistors
  • Industrial temperature range: –40°C to 85°C
  • Spread Spectrum Clock Compatible (SSC)
  • Packaged in
    • 9.9-mm × 3.91-mm, 16-pin SOIC (D)
    • 5.0-mm × 4.4-mm, 16-pin TSSOP (PW)