Thermal resistance, active area to test point 1 (TP1)(1)
0.50
°C/W
(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the
package. The cooling system must be capable of maintaining the package within
the temperature range specified in the Section 6.4. The total heat load on the DMD is largely
driven by the incident light absorbed by the active area, although other
contributions include light energy absorbed by the window aperture and
electrical power dissipation of the array.
Optical systems should be designed to minimize the light energy falling outside
the window clear aperture since any additional thermal load in this area can
significantly degrade the reliability of the device.