JAJSHS8F June   2011  – February 2024 TPA6211A1-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2. 4.1 DAPPER
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Dissipation Ratings
    8.     Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Advantages of Fully Differential Amplifiers
      2. 6.3.2 Fully Differential Amplifier Efficiency and Thermal Information
      3. 6.3.3 Differential Output Versus Single-Ended Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Differential Input Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Resistors (RI)
          2. 7.2.1.2.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 7.2.1.2.3 Input Capacitor (CI)
          4. 7.2.1.2.4 Band-Pass Filter (RI, CI, and CF)
            1. 7.2.1.2.4.1 Step 1: Low-Pass Filter
            2. 7.2.1.2.4.2 Step 2: High-Pass Filter
            3. 7.2.1.2.4.3 Step 3: Additional Low-Pass Filter
          5. 7.2.1.2.5 Decoupling Capacitor (CS)
          6. 7.2.1.2.6 Using Low-ESR Capacitors
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Other Application Circuits
  9. 8 Power Supply Recommendations
    1. 8.1 Power Supply Decoupling Capacitor
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Community Resources
    3. 10.3 Trademarks
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Revision History

Changes from Revision E (August 2019) to Revision F (February 2024)

  • 「特長」の「デバイス HBM ESD 分類レベル」を変更： 車載アプリケーション認定済みGo
  • Changed the ESD Ratings for HBM to ±2000VGo

Changes from Revision D (August 2019) to Revision E (August 2019)

  • パッケージを HVSSOP に変更Go
  • Changed packaging to HVSSOPGo
  • Changed packaging to HVSSOPGo

Changes from Revision C (August 2016) to Revision D (August 2019)

  • 「特長」から AEC-Q100 を削除 車載アプリケーション認定済みGo
  • 「特長」を削除：温度グレード 2Go
  • Changed the ESD Ratings tableGo

Changes from Revision B (January 2014) to Revision C (August 2016)

  • 「製品情報」表、「ESD 定格」表、「機能説明」セクション、「デバイスの機能モード」セクション、「アプリケーションと実装」セクション、「電源に関する推奨事項」セクション、「レイアウト」セクション、「デバイスおよびドキュメントのサポート」セクション、「メカニカル、パッケージ、および注文情報」セクションを追加。Go
  • Added missing Max Ambient Temperature values to Table 6-1 Go
  • Changed 45.9 to 71.7, 1.27 to 1.25, and 91.7 to 60 in Equation 13 Go

Changes from Revision A (November 2013) to Revision B (January 2014)

  • Added three new equations to the DIFFERENTIAL OUTPUT VERSUS SINGLE-ENDED OUTPUT section in order to show difference between single-ended and differential outputGo

Changes from Revision * (June 2011) to Revision A (November 2013)

  • 「特長」リストから「携帯電話および PDA 用に設計」を削除 Go
  • Deleted Ordering Information tableGo
  • Changed reference from "equation 6" to Equation 26 in the High-Pass Filter sectionGo