JAJSIN7 February   2020 TPS59632-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション概略図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation
      2. 7.3.2  Current Sensing
      3. 7.3.3  Load-line (Droop)
      4. 7.3.4  Load Transients
      5. 7.3.5  Overshoot Reduction (OSR)
      6. 7.3.6  Undershoot Reduction (USR)
      7. 7.3.7  Autobalance Current Sharing
      8. 7.3.8  PWM And SKIP Signals
      9. 7.3.9  Bias Power (V5A, VDD, And VINTF) UVLO
      10. 7.3.10 Start-Up Sequence
      11. 7.3.11 Power Good Operation
      12. 7.3.12 Analog Current Monitor, IMON, And Corresponding Digital Output Current
      13. 7.3.13 Fault Behavior
      14. 7.3.14 Output Under Voltage Protection (UVP)
      15. 7.3.15 Output Over Voltage Protection (OVP)
      16. 7.3.16 Over Current Protection (OCP)
      17. 7.3.17 Over Current Warning
      18. 7.3.18 Input Voltage Limits
      19. 7.3.19 VID Table
    4. 7.4 User Selections
    5. 7.5 I2C Interface Operation
      1. 7.5.1 Key For Protocol Examples
      2. 7.5.2 Protocol Examples
    6. 7.6 I2C Register Maps
      1. 7.6.1 Voltage Select Register (VSR) (Address = 00h)
      2. 7.6.2 IMON Register (Address = 03h)
      3. 7.6.3 VMAX Register (Address = 04h)
      4. 7.6.4 Power State Register (Address = 06h)
      5. 7.6.5 Slew Register (Address = 07h)
      6. 7.6.6 Lot Code Registers (Address = 10-13h)
      7. 7.6.7 Fault Register (Address = 14h)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 3-Phase D-CAP+™, Step-Down Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Step 1: Select Switching Frequency
          2. 8.2.1.2.2  Step 2: Set The Slew Rate
          3. 8.2.1.2.3  Step 3: Set The I2C Address
          4. 8.2.1.2.4  Step 4: Determine Inductor Value And Choose Inductor
          5. 8.2.1.2.5  Step 5: Current Sensing Resistance
          6. 8.2.1.2.6  Step 6: Select Over Current Protection (OCP) Setting
          7. 8.2.1.2.7  Step 7: Current Monitor (IMON) Setting
          8. 8.2.1.2.8  Step 8: Set the Load-Line Slope
          9. 8.2.1.2.9  Step 9: Voltage Feedback Resistor Calculation
          10. 8.2.1.2.10 Step 10: Ramp Compensation Selection
          11. 8.2.1.2.11 Step 11 Overshoot Reduction (OSR) selection
          12. 8.2.1.2.12 Step 12: Undershoot Reduction (USR) selection
          13. 8.2.1.2.13 Step 13: Loop Compensation
        3. 8.2.1.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1  Layout Guidelines
    2. 10.2  Layout Example
    3. 10.3  Current Sensing Lines
    4. 10.4  Feedback Voltage Sensing Lines
    5. 10.5  PWM And SKIP Lines
    6. 10.6  Power Chain Symmetry
    7. 10.7  Component Location
    8. 10.8  Grounding Recommendations
    9. 10.9  Decoupling Recommendations
    10. 10.10 Conductor Widths
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
    2. 11.2 商標
    3. 11.3 静電気放電に関する注意事項
    4. 11.4 Glossary
  12. 12メカニカル、パッケージ、および注文情報
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape And Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12.1.1 Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking(4)(5)
TPS59632QRHBRQ1 PREVIEW QFN RHB 32 3000 GREEN
(RoHS and no Sb/Br)		 CU NIPDAU Level-2-260C-1 YEAR –40 to 125 TPS59632Q
TPS59632QRHBTQ1 PREVIEW QFN RHB 32 250 GREEN
(RoHS and no Sb/Br)		 CU NIPDAU Level-2-260C-1 YEAR –40 to 125 TPS59632Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
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(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
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(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.