JAJSGB4A September   2018  – December 2018 TVS2701

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      8/20rep%#181;sのサージ・イベントに対する電圧クランプの応答
      2.      機能ブロック図
  4. 改訂履歴
  5. 概要(続き)
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings - JEDEC
    3. 8.3 ESD Ratings - IEC
    4. 8.4 Recommended Operating Conditions
    5. 8.5 Thermal Information
    6. 8.6 Electrical Characteristics
    7. 8.7 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Protection Specifications
      2. 9.4.2 Reliability Testing
      3. 9.4.3 Zero Derating
      4. 9.4.4 Bidirectional Operation
      5. 9.4.5 Transient Performance
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントのサポート
      1. 13.1.1 関連資料
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 コミュニティ・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

The optimum placement is close to the connector. EMI during an ESD event can couple from the tested trace to other nearby unprotected traces, which could result in system failures. The PCB designer must minimize the possibility of EMI coupling by keeping all unprotected traces away from protected traces between the TVS and the connector. Route the protected traces straight. Use rounded corners with the largest radii possible to eliminate any sharp corners on the protected traces between the TVS2701 and the connector. Electric fields tend to build up on corners, which could increase EMI coupling.

Ensure that the thermal pad on the layout is floating rather than grounded. Grounding the thermal pad will impede the operating range of the TVS2701, and can cause failures when the applied voltage is negative. A floating thermal pad allows the maximum operating range without sacrificing any transient performance.