JAJSRB6 September   2023 TXH0137D-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1特長
  3. 2アプリケーション
  4. 3概要
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Resistive Load Drive
      2. 6.4.2 ON State Input Current
      3. 6.4.3 High-Drive Outputs
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 TTL and other Logic Inputs
        2. 7.2.2.2 High-Impedance Input Drivers
        3. 7.2.2.3 Output Low Voltage
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 Improving Package Thermal Performance
  9. 7Device and Documentation Support
    1. 7.1 ドキュメントの更新通知を受け取る方法
    2. 7.2 サポート・リソース
    3. 7.3 Trademarks
    4. 7.4 静電気放電に関する注意事項
    5. 7.5 用語集
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Option Addendum
    2. 9.2 Tape and Reel Information
    3. 9.3 Mechanical Data

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) TXH0137D-Q1 UNIT
TSSOP (PW)
16 PINS
θJA Junction-to-ambient thermal resistance 113.1 °C/W
θJCtop Junction-to-case (top) thermal resistance 46.5 °C/W
θJB Junction-to-board thermal resistance 58.6 °C/W
ψJT Junction-to-top characterization parameter 7 °C/W
ψJB Junction-to-board characterization parameter 58 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.