SBOU312 august   2023 ISOTMP35 , ISOTMP35-Q1

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  8. 2Hardware
    1. 2.1 Overview
    2. 2.2 High Voltage Connection Setup Guide
      1. 2.2.1 Detaching the Sensor
      2. 2.2.2 Attaching Sensor Section to High Voltage Heat Source
    3. 2.3 Perforations
    4. 2.4 Status LEDs & Subregulator
    5. 2.5 Programming Header
    6. 2.6 Pushbutton Switch
    7. 2.7 RC Filter
  9. 3Software
    1. 3.1 Software Download
      1. 3.1.1 Online Software
      2. 3.1.2 Offline Software
    2. 3.2 Home Tab
    3. 3.3 Data Capture Tab
    4. 3.4 Collateral Tab
  10. 4Hardware Design Files
    1. 4.1 ISOTMP35BEVM Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1.     Trademarks

2.2.2 Attaching Sensor Section to High Voltage Heat Source

Once the user has reconnected the sensor breakout board, the user can attach the EVM to a high-voltage heat source using the bottom-side copper plate. This plate can be attached directly to a heat source, such as a heat-sink from a high-power MOSFET or a high-voltage bus bar, using glue or screws.

  • For best thermal conductivity, do not place an insulator between the high-voltage heat source and the EVM bottom copper plate. Direct metal-to-metal contact is recommended.
  • To decrease the ISOTMP35 response time, apply a thin layer of thermal conductive paste between the connector and the high-voltage heat source.
  • Dissimilar metals in contact can increase the thermal resistance, to minimize this effect use thermal conductive paste.
  • If screwing the EVM bottom copper connector on a high-power MOSFET, then TI recommends to minimize connection distance to the MOSFET.
  • When screwing on the EVM to any high-voltage heat source, note that the FR4 expands and contracts with temperature. FR4 is a forgiving dielectric in terms of thermal expansion, but the user must periodically check that the screwing remains fastened when safe to do so.
  • When gluing the EVM copper pad to a high voltage heat source, use as little glue as possible to make sure the connection is secure, excess glue increases the thermal resistance, therefore increasing response time. Once again, thermal conductive paste between the two different metals helps to reduce the metal-to-metal thermal resistance.