SLUUCU2A March   2023  – September 2023 UCC14130-Q1 , UCC14131-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 U1 Component Selection
    2. 1.2 Pin Configuration and Functions
  5. 2Description
    1. 2.1 EVM Electrical Performance Specifications
  6. 3Schematic
  7. 4EVM Setup and Operation
    1. 4.1 Recommended Test Equipment
    2. 4.2 External Connections for Easy Evaluation
    3. 4.3 Powering the EVM
      1. 4.3.1 Power on for Start-up
      2. 4.3.2 Power off for Shutdown
    4. 4.4 EVM Test Points
    5. 4.5 Probing the EVM
  8. 5Performance Data
    1. 5.1  Efficiency Data
    2. 5.2  Regulation Data
    3. 5.3  Steady State Input Current
    4. 5.4  Start-Up Waveforms
    5. 5.5  Inrush Current
    6. 5.6  AC Ripple Voltage
    7. 5.7  EN and Timing
    8. 5.8  RLIM
    9. 5.9  Shutdown
    10. 5.10 Thermal Performance
  9. 6Assembly and Printed Circuit Board (PCB) Layers
  10. 7Bill of Materials (BOM)
  11. 8Revision History

1.1 U1 Component Selection

The UCC14131-Q1 is the default IC used in the UCC14131EVM-070 but any of the alternate versions listed in Table 1-1 can be used for evaluation. Each of the component versions listed in Table 1-1 are pin-to-pin compatible, functionally equivalent, drop in replacements with respect to one another.

Table 1-1 UCC1413x-Q1 Version Differences
General Part Number Orderable Part Number Isolation/Surge/Working Voltage
UCC14131-Q1 UCC14131QDWNQ1 5 kVRMS/10 kVPK/1 kVRMS
UCC14130-Q1 UCC14130QDWNQ1 3 kVRMS/6.5 kVPK/850 kVRMS

If U1 replacement is required, then TI recommends to always use best practice soldering techniques. Techniques can include taking appropriate ESD precautions and having qualified personnel, skilled at surface mount soldering and board level rework, removing and installing U1. Visually verify the desired UCC1413x-Q1 component version is properly installed in the EVM. If rework on U1 has previously been performed, then visually verify correct orientation of U1 according to Figure 1-1. The pin 1 identifying dot on top of the IC package is oriented at the top left according to Figure 1-1.