SNIA053 june   2023 TMP61-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Heat Sink Temperature Sensor Monitoring
  5. 2Test Overview
    1. 2.1 Hardware
      1. 2.1.1 Keysight E3631A Power Supply
      2. 2.1.2 Sorensen DCS 40-25E Programmable DC Power Supply
      3. 2.1.3 B&K Precision 8500 DC Electronic Load
      4. 2.1.4 TDS3014B Tektronix Digital Oscilloscope
      5. 2.1.5 Fluke TiS60+ Thermal Imager
      6. 2.1.6 MSP430F5529LP LaunchPad
    2. 2.2 Isolated Gate Driver
    3. 2.3 IGBT Module
    4. 2.4 NTC Ring Lug
    5. 2.5 TMP6 Ring Lug
    6. 2.6 Schematic
  6. 3Test Implementation
    1. 3.1 Data Collected
    2. 3.2 Test Results
  7. 4Design Recommendations
    1. 4.1 Ring Lugs for the TMP6
    2. 4.2 Thermal Epoxy
  8. 5Summary
  9. 6References

2.6 Schematic

The Figure 2-11 shows the portion of the TIDA-020030 reference design schematic used in this application note. The highlighted portion of the schematic is shown in Figure 2-12 is the primary focus of the test in this application note.


GUID-20230327-SS0I-HFMB-D7FN-4SQ2PCKRPHWV-low.svg

Figure 2-11 Full Schematic
GUID-D9F1F664-D437-46D1-830A-BDF44FE6495D-low.png Figure 2-12 Isolated Gate Driver Circuit

Note that J3 in Figure 2-11 is used to apply the inputs to the isolated gate driver as described in the following.

The UCC21732-Q1 isolated gate driver circuit (U1) drives the high side of the IGBT module (MD1). The output pins OUTH (pin 4) and OUTL (pin6) drive the drain of the MOSFET through Gate_U (Pin 13). The isolated gate driver outputs are verified through test points TP1 and TP3. An analog PWM signal from a host MCU is driven to IN+ (pin 10) of the isolated gate driver. This PWM signal is set to an 80% duty cycle at 15 kHz. IN– (pin 11) of the isolated gate driver is connected to GND. An external voltage is applied to HVDC+ (pin 14) of the IGBT module, with pin N grounded, and the switching monitored on pin U.