SPRAC76G November   2022  – February 2024 AM5706 , AM5708 , AM5716 , AM5718 , AM5726 , AM5728 , AM5729 , AM5746 , AM5748 , AM5749 , AM620-Q1 , AM623 , AM625 , AM625-Q1 , AM625SIP , AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442 , AM6526 , AM6528 , AM6546 , AM6548

 

  1.   1
  2.   Sitara Processor Power Distribution Networks: Implementation and Analysis
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Acronyms Used in This Document
  5. 2Guidelines for PCB Stack-Up
  6. 3Physical Layout Optimization of the PDN
  7. 4Static PDN Analysis (IR Drop Optimization)
  8. 5Dynamic Analysis of PCB PDN
    1. 5.1 Selecting Decoupling Capacitors to Meet ZTARGET
  9. 6Checklist for PDN
  10. 7Implementation Examples and PDN Targets
    1. 7.1 AM570x
    2. 7.2 AM571x
    3. 7.3 AM572x
    4. 7.4 AM574x
    5. 7.5 AM65xx/DRA80xM
    6. 7.6 AM62xx
    7. 7.7 AM64xx
    8. 7.8 AM62Ax
  11.   Revision History

1.1 Acronyms Used in This Document

Table 1-1 Acronyms
AcronymDescription
ACAlternating current
BGABall grid array
DCDirect current (static)
DfLoss tangent
DkDielectric constant
EDAElectronic design automation
EMElectromigration
ESLEffective series inductance
ESREffective series resistance
FDTIMFrequency domain target impedance method
HDIHigh density interconnect (for example, buried/blind via)
IRProduct of current (I) x resistance (R)
PCBPrinted circuit board
PDNPower distribution network
PM-IC/PMICPower management integrated circuit
PTHPlated through hole
RLCResistance, inductance, and capacitance
SMPSSwitch mode power supply
SMTSurface mount technology
SRFSelf resonant frequency
VIPVia in pad
VRMVoltage regulator module
Note:

Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific purpose, for customer boards. The data described in this document are intended as guidelines only.