SWRA814 May   2024 CC1311P3 , CC1311R3 , CC1312R , CC1312R7 , CC1314R10 , CC1352P , CC1352P7 , CC1352R , CC1354P10 , CC1354R10

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2CC131x and CC135x Device Family Comparison
    1. 2.1 Device Naming
      1. 2.1.1 Frequency Band
      2. 2.1.2 Generation, Sub-1GHz and Multi-band
      3. 2.1.3 Protocols
      4. 2.1.4 Major Features
      5. 2.1.5 Radio Output Power
      6. 2.1.6 Memory Size
    2. 2.2 Available RF Outputs
    3. 2.3 Device Package Size
      1. 2.3.1 Pin-to-Pin Compatibility
      2. 2.3.2 Package Size and Reference Design
      3. 2.3.3 Available GPIO Count
    4. 2.4 SMD Component Package Size
    5. 2.5 Crystal Oscillator
      1. 2.5.1 Applications Requiring a Slow Clock Accuracy
      2. 2.5.2 Internal Variable Load Capacitor Array
    6. 2.6 Memory
    7. 2.7 Summary Table
  6. 3Device-to-Device Migration Considerations
    1. 3.1 Sub1-GHz Devices
      1. 3.1.1 Migrating from CC1310 to CC131xRx or CC1311P3
      2. 3.1.2 Migrating from CC1312Rx to CC1311R3 or CC1314R10
      3. 3.1.3 Migrating from CC131xRx to CC1311P3
    2. 3.2 Multi-Band Devices
      1. 3.2.1 Migrating from CC1350 to CC135xRx or CC135xPx
      2. 3.2.2 Migrating from CC1352R to CC1354R10
      3. 3.2.3 Migrating from CC135xRx to CC135xPx
      4. 3.2.4 Migrating from CC1352Px to CC1354P10
  7. 4Summary
  8. 5References
    1. 5.1 Recommended Resources
    2. 5.2 Device Data Sheets

3.1.1 Migrating from CC1310 to CC131xRx or CC1311P3

  • The CC1310 RGZ (7mm × 7mm) VQFN variants are pin-to-pin compatible with the CC131xRx RGZ (7mm × 7mm) VQFN devices. A PCB designed for this package size can be reused with only the crystal needing to be changed (detailed below): Section 2.3.
  • The CC1311P3 contains an additional Sub-1GHz +20dBm PA RF path and is not pin-to-pin compatible with the CC1310 RGZ (7mm × 7mm) VQFN variants: Section 2.2.
  • Change from a 24MHz to a 48MHz crystal: Section 2.5.
  • The correct reference design must be chosen for the selected device package size. Refer to application note, CC13xx/CC26xx Hardware Configuration and PCB Design Considerations, if changing the device package size for the relevant reference design: Section 2.3.2.
  • Double-check if the component package size for the new reference design used has changed from 0402 to 0201 (or reuse the existing design if the devices are pin-to-pin compatible): Section 2.4.