SWRA814 May   2024 CC1311P3 , CC1311R3 , CC1312R , CC1312R7 , CC1314R10 , CC1352P , CC1352P7 , CC1352R , CC1354P10 , CC1354R10

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2CC131x and CC135x Device Family Comparison
    1. 2.1 Device Naming
      1. 2.1.1 Frequency Band
      2. 2.1.2 Generation, Sub-1GHz and Multi-band
      3. 2.1.3 Protocols
      4. 2.1.4 Major Features
      5. 2.1.5 Radio Output Power
      6. 2.1.6 Memory Size
    2. 2.2 Available RF Outputs
    3. 2.3 Device Package Size
      1. 2.3.1 Pin-to-Pin Compatibility
      2. 2.3.2 Package Size and Reference Design
      3. 2.3.3 Available GPIO Count
    4. 2.4 SMD Component Package Size
    5. 2.5 Crystal Oscillator
      1. 2.5.1 Applications Requiring a Slow Clock Accuracy
      2. 2.5.2 Internal Variable Load Capacitor Array
    6. 2.6 Memory
    7. 2.7 Summary Table
  6. 3Device-to-Device Migration Considerations
    1. 3.1 Sub1-GHz Devices
      1. 3.1.1 Migrating from CC1310 to CC131xRx or CC1311P3
      2. 3.1.2 Migrating from CC1312Rx to CC1311R3 or CC1314R10
      3. 3.1.3 Migrating from CC131xRx to CC1311P3
    2. 3.2 Multi-Band Devices
      1. 3.2.1 Migrating from CC1350 to CC135xRx or CC135xPx
      2. 3.2.2 Migrating from CC1352R to CC1354R10
      3. 3.2.3 Migrating from CC135xRx to CC135xPx
      4. 3.2.4 Migrating from CC1352Px to CC1354P10
  7. 4Summary
  8. 5References
    1. 5.1 Recommended Resources
    2. 5.2 Device Data Sheets

2.6 Memory

The CC131x and CC135x devices are available in a variety of different memory sizes. The memory size is indicated in the device name for quick identification of the device memory, as discussed in Section 2.1.6.

The devices, CC1311R3 and CC13x4, have the same memory for all of the available package sizes.

The CC1310 devices have three different memory options for each available package size (the package sizes are listed in Section 2.3). Later devices indicate the memory size in the part number to allow easier identification of the device features, as shown in Section 2.1.6.

Table 2-12 provides a summary of the different device memory sizes available for the CC131x and CC135x devices and Table 2-13 separately lists the memory sizes available for the different CC13x0 package sizes.

Table 2-12 CC131x and CC135x Device Memory Sizes
Device Flash (kB) RAM + Cache (kB)
CC1311R3 352 32 + 8
CC1311P3 352 32 + 8
CC1312R 352 80 + 8
CC1312R7 704 144 + 8
CC1314R10 1024 256 + 8
CC1352R 352 80 + 8
CC1354R10 1024 256 + 8
CC1352P 352 80 + 8
CC1352P7 704 144 + 8
CC1354P10 1024 256 + 8
Table 2-13 CC13x0 Device Memory Sizes
Device Package Size Flash (kB) RAM + Cache (kB)
CC1310F128RSM RSM (4mm × 4mm VQFN32) 128 20 + 8
CC1310F64RSM 64 16 + 8
CC1310F32RSM 32 16 + 8
CC1350F128RSM 128 20 + 8
CC1310F128RHB RHB (5mm × 5mm VQFN32) 128 20 + 8
CC1310F64RHB 64 16 + 8
CC1310F32RHB 32 16 + 8
CC1350F128RHB 128 20 + 8
CC1310F128RGZ RGZ (7mm × 7mm VQFN48) 128 20 + 8
CC1310F64RGZ 64 16 + 8
CC1310F32RGZ 32 16 + 8
CC1350F128RGZ 128 20 + 8

The increase in memory when migrating from a CC13x0 device to a CC13x1, CC13x2, or CC13x4 device allows for multiple stacks to run concurrently through a DMM driver.