TIDUES0E June   2019  – April 2024 TMS320F28P550SJ , TMS320F28P559SJ-Q1

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1  UCC21710
      2. 2.2.2  UCC14141-Q1
      3. 2.2.3  AMC1311
      4. 2.2.4  AMC1302
      5. 2.2.5  OPA320
      6. 2.2.6  AMC1306M05
      7. 2.2.7  AMC1336
      8. 2.2.8  TMCS1133
      9. 2.2.9  TMS320F280039C
      10. 2.2.10 TLVM13620
      11. 2.2.11 ISOW1044
      12. 2.2.12 TPS2640
    3. 2.3 System Design Theory
      1. 2.3.1 Dual Active Bridge Analogy With Power Systems
      2. 2.3.2 Dual-Active Bridge – Switching Sequence
      3. 2.3.3 Dual-Active Bridge – Zero Voltage Switching (ZVS)
      4. 2.3.4 Dual-Active Bridge - Design Considerations
        1. 2.3.4.1 Leakage Inductor
        2. 2.3.4.2 Soft Switching Range
        3. 2.3.4.3 Effect of Inductance on Current
        4. 2.3.4.4 Phase Shift
        5. 2.3.4.5 Capacitor Selection
          1. 2.3.4.5.1 DC-Blocking Capacitors
        6. 2.3.4.6 Switching Frequency
        7. 2.3.4.7 Transformer Selection
        8. 2.3.4.8 SiC MOSFET Selection
      5. 2.3.5 Loss Analysis
        1. 2.3.5.1 SiC MOSFET and Diode Losses
        2. 2.3.5.2 Transformer Losses
        3. 2.3.5.3 Inductor Losses
        4. 2.3.5.4 Gate Driver Losses
        5. 2.3.5.5 Efficiency
        6. 2.3.5.6 Thermal Considerations
  9. 3Circuit Description
    1. 3.1 Power Stage
    2. 3.2 DC Voltage Sensing
      1. 3.2.1 Primary DC Voltage Sensing
      2. 3.2.2 Secondary DC Voltage Sensing
        1. 3.2.2.1 Secondary Side Battery Voltage Sensing
    3. 3.3 Current Sensing
    4. 3.4 Power Architecture
      1. 3.4.1 Auxiliary Power Supply
      2. 3.4.2 Gate Driver Bias Power Supply
      3. 3.4.3 Isolated Power Supply for Sense Circuits
    5. 3.5 Gate Driver Circuit
    6. 3.6 Additional Circuitry
    7. 3.7 Simulation
      1. 3.7.1 Setup
      2. 3.7.2 Running Simulations
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Required Hardware and Software
      1. 4.1.1 Hardware
      2. 4.1.2 Software
        1. 4.1.2.1 Getting Started With Software
        2. 4.1.2.2 Pin Configuration
        3. 4.1.2.3 PWM Configuration
        4. 4.1.2.4 High-Resolution Phase Shift Configuration
        5. 4.1.2.5 ADC Configuration
        6. 4.1.2.6 ISR Structure
    2. 4.2 Test Setup
    3. 4.3 PowerSUITE GUI
    4. 4.4 LABs
      1. 4.4.1 Lab 1
      2. 4.4.2 Lab 2
      3. 4.4.3 Lab 3
      4. 4.4.4 Lab 4
      5. 4.4.5 Lab 5
      6. 4.4.6 Lab 6
      7. 4.4.7 Lab 7
    5. 4.5 Test Results
      1. 4.5.1 Closed-Loop Performance
  11. 5Design Files
    1. 5.1 Schematics
    2. 5.2 Bill of Materials
    3. 5.3 Altium Project
    4. 5.4 Gerber Files
    5. 5.5 Assembly Drawings
  12. 6Related Documentation
    1. 6.1 Trademarks
  13. 7Terminology
  14. 8About the Author
  15. 9Revision History

2.3.4.7 Transformer Selection

In a power supply design, transformers and inductors are major contributors to size. Increasing the operating frequency reduces the size, but increasing the switching frequency beyond a particular value affects the efficiency of the power module. This is because the skin effect becomes very high at that frequency where the current flows through the surface of the conductor. Similar to the skin effect, there is a proximity effect, which causes current to only flow on surfaces closest to each other. Furthermore, from a proximity standpoint in high-frequency designs, conductor size and the number of layers must be optimized. With a planar transformer, more interleaving to reduce the proximity effect can be achieved. This interleaving can be tailored to produce a specific amount of leakage so as to aid in power transfer and to contribute to ZVS.

Planar transformers offer the following advantages over conventional transformers and hence were used in this reference design:

  • Planar magnetics have very high power density. They are more compact and consume less space when compared to a conventional transformer of the same power rating.
  • They have the ability to do more interleaving to reduce AC conductor losses.
  • They have consistent spacing between turns and layers which translate into consistent parasitics. Both leakage inductance and intra-winding capacitances can be maintained to very predictable and tight values.
  • Tight control over the leakage inductance is possible with planar magnetics.
  • The compact size of the transformer can support integration of the additional shim inductor with the transformer itself without the need for a separate component on board.

The leakage inductor alone cannot provide soft switching up to light loads. As seen previously, increasing the soft switching range by increasing inductor value increases the RMS currents. In practice, a leakage inductor is chosen to provide soft switching only up to ½ or ⅓ of rated load. To increase the soft switching range, multiphase-shift controls can be applied. In some applications increased switching losses because of hard switching are acceptable for low loads since conduction losses decrease for low loads.