SNVA853C December   2019  – March 2024 LMZ10500 , LMZ10501 , LMZ20501 , LMZ20502 , LMZ21700 , LMZ21701 , LMZ30604 , LMZ31506 , LMZ31520 , LMZ31530 , LMZ31704 , LMZ31707 , LMZ31710 , LMZ34202 , LMZ35003 , LMZ36002 , LMZM23600 , LMZM23601 , LMZM33602 , LMZM33603 , LMZM33604 , LMZM33606 , TLVM13610 , TLVM13630 , TLVM13640 , TLVM13660 , TLVM23615 , TLVM23625 , TPS82085 , TPS82130 , TPSM265R1 , TPSM33615 , TPSM33625 , TPSM365R3 , TPSM365R6 , TPSM53604 , TPSM5601R5 , TPSM5601R5H , TPSM5601R5HE , TPSM560R6 , TPSM63603 , TPSM63604 , TPSM63606 , TPSM63608 , TPSM63610 , TPSM84424 , TPSM84624 , TPSM846C23 , TPSM846C24 , TPSM84824

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Package Types
    1. 2.1 MicroSiP
    2. 2.2 QFN Overmolded
    3. 2.3 QFN Open Frame
    4. 2.4 Leaded
    5. 2.5 QFN-FCMOD
  6. 3Package CAD/CAE Symbols and Footprints
  7. 4Soldering
    1. 4.1 MSL Ratings
    2. 4.2 Reflow Profile
    3. 4.3 Back Side PCB Mounting Considerations
      1. 4.3.1 Method 1 - Solder Surface Perimeter
      2. 4.3.2 Method 2 - Solder Surface Area
      3. 4.3.3 Back Side PCB Mounting Evaluation of TI Modules
      4. 4.3.4 Reflow Fixture
  8. 5Rework During Prototyping
  9. 6References
  10. 7Revision History

4.3.4 Reflow Fixture

As suggested by Table 4-1, placing some devices on the back side of the PCB with a second reflow may not be feasible. In such cases, a reflow fixture can be designed to hold the heavy components during the second reflow. Contact TI for possible fixture suggestions based on the particular application board design.