SPRACC0A November   2017  – November 2020 TMS320F28075 , TMS320F28075-Q1 , TMS320F28076 , TMS320F28374D , TMS320F28374S , TMS320F28375D , TMS320F28375S , TMS320F28375S-Q1 , TMS320F28376D , TMS320F28376S , TMS320F28377D , TMS320F28377D-EP , TMS320F28377D-Q1 , TMS320F28377S , TMS320F28377S-Q1 , TMS320F28378D , TMS320F28378S , TMS320F28379D , TMS320F28379D-Q1

 

  1.   Trademarks
  2. Introduction and Scope
  3. SRAM Bit Array
  4. Sources of SRAM Failures
    1. 3.1 Manufacturing Defects
      1. 3.1.1 Time Zero Fails
      2. 3.1.2 Latent Fails
    2. 3.2 Circuit Drift With Usage
    3. 3.3 Circuit Overstress
    4. 3.4 Soft Errors
      1. 3.4.1 Radioactive Events
      2. 3.4.2 Dynamic Voltage Events
      3. 3.4.3 Summary of Error Sources
  5. Methods for Managing Memory Failures in Electronic Systems
    1. 4.1 Start-Up Testing
    2. 4.2 In-System Testing
    3. 4.3 Parity Detection
    4. 4.4 Error Detection and Correction (EDAC)
    5. 4.5 Redundancy
  6. Comparisons and Conclusions
  7. C2000 Memory Types Example
    1. 6.1 TMS320F2837xD
  8. Memory Types
    1. 7.1 Dedicated RAM (Mx and Dx RAM)
    2. 7.2 Local Shared RAM (LSx RAM)
    3. 7.3 Global Shared RAM (GSx RAM)
    4. 7.4 CPU Message RAM (CPU MSGRAM)
    5. 7.5 CLA Message RAM (CLA MSGRAM)
  9. Summary
  10. References
  11. 10Revision History

Comparisons and Conclusions

Table 5-1 provides a summary of which detection mechanisms provide what protection level.

Table 5-1 Detection Mechanisms and Protection Levels
SRAM Coverage Start-Up In-System Parity EDaC Redundant
Single bit per word hard failures Y Y Y Y Y
In-system degradation single bit per word failures N Maybe 1 Y Y Y
Soft errors N N Y Y Y
Multi-bit per word N N Maybe Y Y
Safe state N N Y Y Y
System availability N N N Y Y
Fail safe N N N N Y
  1. In-system testing only catches this failure if the in-system tests check the failing word before the system does. While this is likely, it is not guaranteed.