SLUSB33A May   2012  – December 2014 UCC27518 , UCC27519

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 VDD and Undervoltage Lockout
      2. 9.3.2 Operating Supply Current
      3. 9.3.3 Input Stage
      4. 9.3.4 Enable Function
      5. 9.3.5 Output Stage
      6. 9.3.6 Low Propagation Delays
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input-to-Output Logic
        2. 10.2.2.2 Input Threshold Type
        3. 10.2.2.3 VDD Bias Supply Voltage
        4. 10.2.2.4 Peak Source and Sink Currents
        5. 10.2.2.5 Enable and Disable Function
        6. 10.2.2.6 Propagation Delay
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
    4. 12.4 Power Dissipation
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Low-Cost, Gate-Driver Device Offering Superior Replacement of NPN and PNP Discrete Solutions
  • Pin-to-Pin Compatible With TI's TPS2828 and TPS2829 devices
  • 4-A Peak Source and 4-A Peak Sink Symmetrical Drive
  • Fast Propagation Delays (17-ns Typical)
  • Fast Rise and Fall Times (8-ns and 7-ns Typical)
  • 4.5-V to 18-V Single Supply Range
  • Outputs Held Low During VDD UVLO (Ensures Glitch-Free Operation at Power Up and Power Down)
  • CMOS Input Logic Threshold (Function of Supply Voltage With Hysteresis)
  • Hysteretic Logic Thresholds for High Noise Immunity
  • EN Pin for Enable Function (Allowed to Be No Connect)
  • Output Held Low when Input Pins are Floating
  • Input Pin Absolute Maximum Voltage Levels Not Restricted by VDD Pin Bias Supply Voltage
  • Operating Temperature Range of –40°C to 140°C
  • 5-Pin DBV Package (SOT-23)

2 Applications

  • Switched-Mode Power Supplies
  • DC-DC Converters
  • Companion Gate Driver Devices for Digital Power Controllers
  • Solar Power, Motor Control, UPS
  • Gate Driver for Emerging Wide Band-Gap Power Devices (Such as GaN)

3 Description

The UCC27518 and UCC27519 single-channel, high-speed, low-side gate driver device can effectively drive MOSFET and IGBT power switches. Using a design that inherently minimizes shoot-through current, UCC27518 and UCC27519 can source and sink high, peak-current pulses into capacitive loads offering rail-to-rail drive capability and extremely small propagation delay typically 17 ns.

The UCC27518 and UCC27519 provide 4-A source, 4-A sink (symmetrical drive) peak-drive current capability at VDD = 12 V.

The UCC27518 and UCC27519 are designed to operate over a wide VDD range of 4.5 V to 18 V and a wide temperature range of –40°C to 140°C. Internal under voltage lockout (UVLO) circuitry on the VDD pin holds output low outside VDD operating range. The capability to operate at low voltage levels such as below 5 V, along with best-in-class switching characteristics, is especially suited for driving emerging wide band-gap power switching devices such as GaN power semiconductor devices.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
UCC27518 SOT-23 (5) 2.90 mm × 1.60 mm
UCC27519
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Typical Application Diagram

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