Produktdetails

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 188 IOH (max) (mA) -80 Input type TTL Output type TTL Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Very high speed (tpd 5-10ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 188 IOH (max) (mA) -80 Input type TTL Output type TTL Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Very high speed (tpd 5-10ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (DW) 24 159.65 mm² 15.5 x 10.3
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Impedance State During Power Up and Power Down
  • Designed to Facilitate Incident-Wave Switching for Line Impedances of 25 or Greater
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic Small-Outline (DW) Package, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) DIPs

EPIC-IIB is a trademark of Texas Instruments Incorporated.

  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Impedance State During Power Up and Power Down
  • Designed to Facilitate Incident-Wave Switching for Line Impedances of 25 or Greater
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic Small-Outline (DW) Package, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) DIPs

EPIC-IIB is a trademark of Texas Instruments Incorporated.

The 'ABTH25245 are 25- octal bus transceivers designed for asynchronous communication between data buses. They improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented transceivers.

These devices allow noninverted data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE\) input can disable the device so that both buses are effectively isolated. When OE\ is low, the device is active.

These transceivers are capable of sinking 188 mA of IOL current, which facilitates switching 25- transmission lines on the incident wave. The distributed VCC and GND pins minimize switching noise for more-reliable system operation.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABTH25245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABTH25245 is characterized for operation from -40°C to 85°C.

The 'ABTH25245 are 25- octal bus transceivers designed for asynchronous communication between data buses. They improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented transceivers.

These devices allow noninverted data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE\) input can disable the device so that both buses are effectively isolated. When OE\ is low, the device is active.

These transceivers are capable of sinking 188 mA of IOL current, which facilitates switching 25- transmission lines on the incident wave. The distributed VCC and GND pins minimize switching noise for more-reliable system operation.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABTH25245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABTH25245 is characterized for operation from -40°C to 85°C.

Herunterladen Video mit Transkript ansehen Video

Ähnliche Produkte, die für Sie interessant sein könnten

Gleiche Funktionalität, gleiche Pinbelegung wie verglichener Baustein
SN74AHCT245 AKTIV Achtfache Bustransceiver mit Tri-State-Ausgängen Larger voltage range (2V to 5.5V)

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 20
Typ Titel Datum
* Data sheet 25-Ohm Octal Bus Transceivers With 3-State Outputs datasheet (Rev. F) 01 Mai 1997
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 17 Sep 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 16 Feb 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 Mai 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 Jan 2001
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 01 Mär 1997
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 01 Dez 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 Mai 1996

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

14-24-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14-polige bis 24-polige D-, DB-, DGV-, DW-, DYY-, NS-

Das 14-24-LOGIC-EVM-Evaluierungsmodul (EVM) ist für die Unterstützung aller Logikgeräte konzipiert, die sich in einem 14-Pin- bis 24-Pin-D-, DW-, DB-, NS-, PW-, DYY- oder DGV-Gehäuse befinden.

Benutzerhandbuch: PDF | HTML
Gehäuse Pins Herunterladen
SOIC (DW) 24 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos