Produktdetails

Technology family BCT Supply voltage (min) (V) -0.5 Supply voltage (max) (V) 7 Number of channels 8 IOL (max) (mA) 76 Supply current (max) (µA) 76 IOH (max) (mA) 0 Input type Bipolar Output type Open-collector Features High speed (tpd 10-50ns), Over-voltage tolerant inputs Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family BCT Supply voltage (min) (V) -0.5 Supply voltage (max) (V) 7 Number of channels 8 IOL (max) (mA) 76 Supply current (max) (µA) 76 IOH (max) (mA) 0 Input type Bipolar Output type Open-collector Features High speed (tpd 10-50ns), Over-voltage tolerant inputs Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Open-Collector Version of 'BCT244
  • Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C Method 3015
  • Available In Plastic Small-Outline (DW) Package

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified >performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Open-Collector Version of 'BCT244
  • Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C Method 3015
  • Available In Plastic Small-Outline (DW) Package

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified >performance and environmental limits.

The SN74BCT760 octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.

The device is characterized for operation over the full military temperature range of -55°C to 125°C.

The SN74BCT760 octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.

The device is characterized for operation over the full military temperature range of -55°C to 125°C.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet SN74BCT760-EP datasheet (Rev. B) 07 Sep 2006
* VID SN74BCT760-EP VID V6206672 21 Jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996

Design und Entwicklung

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