Produktdetails

Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Click/Pop noise reduction, FM Transmission Capability Supply voltage (min) (V) 2.6 Supply voltage (max) (V) 4.7 Supply current (typ) (µA) 6.5 Operating temperature range (°C) -40 to 85 Rating Catalog
Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Click/Pop noise reduction, FM Transmission Capability Supply voltage (min) (V) 2.6 Supply voltage (max) (V) 4.7 Supply current (typ) (µA) 6.5 Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFF) 9 1.96000000000000028000000000000001 mm² 1.4000000000000001 x 1.4000000000000001
  • Ground FET Switches (60mΩ typical)
  • Autonomous Detection of Headset Types:
    3-Poles or 4-Poles (with MIC on SLEEVE or RING2)
  • Microphone Line Switches
  • Supports FM Signal Transmission Through the Ground FETs
  • Reduction of Click/Pop Noise
  • VDD Range: 2.6 V – 4.7 V
  • THD (Mic): 0.002% Typical
  • Low Current Consumption: 6.5-µA Typical
  • ±8kV Contract Discharge (IEC 61000-4-2) ESD Performance on SLEEVE and RING2 Pins
  • Ground FET Switches (60mΩ typical)
  • Autonomous Detection of Headset Types:
    3-Poles or 4-Poles (with MIC on SLEEVE or RING2)
  • Microphone Line Switches
  • Supports FM Signal Transmission Through the Ground FETs
  • Reduction of Click/Pop Noise
  • VDD Range: 2.6 V – 4.7 V
  • THD (Mic): 0.002% Typical
  • Low Current Consumption: 6.5-µA Typical
  • ±8kV Contract Discharge (IEC 61000-4-2) ESD Performance on SLEEVE and RING2 Pins

The TS3A226AE is an audio headset switch that detects 3- or 4-pole 3.5mm accessories. For a 4-pole accessory with a microphone, the TS3A226AE also detects the MIC location and routes the microphone and ground signals automatically. The ground signal is routed through a pair of low-impedance ground FETs (60mΩ typical), resulting minimal impact on audio cross-talk performance. The autonomous detection feature allows end users to plug in accessories with different audio pole configurations into the mobile device and have them operate properly with no added software control and complexity. The ground FETs of the device are designed to allow FM signal pass-through, making it possible to use the ground line of the headset as an FM antenna in mobile audio application.

The TS3A226AE is packaged within a 1.2mm × 1.2mm WCSP package, making it suitable for use in mobile application.

The TS3A226AE is an audio headset switch that detects 3- or 4-pole 3.5mm accessories. For a 4-pole accessory with a microphone, the TS3A226AE also detects the MIC location and routes the microphone and ground signals automatically. The ground signal is routed through a pair of low-impedance ground FETs (60mΩ typical), resulting minimal impact on audio cross-talk performance. The autonomous detection feature allows end users to plug in accessories with different audio pole configurations into the mobile device and have them operate properly with no added software control and complexity. The ground FETs of the device are designed to allow FM signal pass-through, making it possible to use the ground line of the headset as an FM antenna in mobile audio application.

The TS3A226AE is packaged within a 1.2mm × 1.2mm WCSP package, making it suitable for use in mobile application.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 7
Typ Titel Datum
* Data sheet AUTONOMOUS AUDIO HEADSET SWITCH, TS3A226AE datasheet (Rev. A) 24 Jul 2013
Technical article USB Type-C™ power: Should your next device have USB Type-C? PDF | HTML 14 Feb 2017
Technical article USB Type-C audio: Do I need to buy a new pair of headphones? PDF | HTML 07 Jul 2016
Application note Support Selfie Sticks Using a TS3A227E Audio Jack Switch 04 Mär 2016
EVM User's guide TS3A226AE EVM Board User’s Guide (Rev. B) 13 Aug 2013
Application note Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

TS3A226AEEVM — TS3A226AE-Evaluierungsmodul für autonomen Audio-Headset-Schalter

The TS3A226AEEVM is an evaluation module (EVM) for the Texas Instruments (TI) autonomous audio-headset switch. The EVM provides the basic functionality evaluation for theTS3A226AE device and provides peripheral connector for codec signal connection to MICP, TIP and RING1.

The TS3A226AE is an (...)

Benutzerhandbuch: PDF
Simulationsmodell

TS3A226E HSPICE Model

SCDM156.ZIP (476 KB) - HSpice Model
Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Referenzdesigns

TIDA-03030 — USB Typ-C™-Leistungszweigschutz mit Audio-Zubehör-Support – Referenzdesign

The TIDA-03030 reference design provides a robust protection solution for the power path in USB Type-C™ applications. The design protects the power path from overvoltage, overcurrent, hot-plug, and reverse-current events by leveraging the TPS25923 (eFuse) and CSD17571Q2 (reverse-blocking (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDA-00006 — Headset-Erkennungsschalter zur Erkennung von 3-poligem oder 4-poligem 3,5-mm-Zubehör

This reference design is for autonomous audio headset switch applications. Some audio headsets have integrated analog microphones. The GND and MIC connections on the audio jack connector may be swapped depending on the manufacturer. This design has the ability to detect the presence of an analog (...)
Schaltplan: PDF
Gehäuse Pins Herunterladen
DSBGA (YFF) 9 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos