TXS0202

AKTIV

Spannungspegelumsetzer für IC-USB-Schnittstelle

Produktdetails

Technology family TXS Applications Interchip USB Rating Catalog Operating temperature range (°C) -40 to 85
Technology family TXS Applications Interchip USB Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25
  • No Direction Control Signal Required
  • VCCA, VCCB Supply Voltage: 1.65 V to 3.6 V
  • Meets All Requirements of the IC-USB Standard
  • Small Packages: WCSP
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Ioff Supports Partial-Power-Down Mode Operation
  • ESD Performance
    • A port (Host-Side)
      • 2000-V Human-Body Model
      • 100-V Machine Model
      • 500-V Charged-Device Model
    • B port (Peripheral-Side)
      • >4kV HBM

  • No Direction Control Signal Required
  • VCCA, VCCB Supply Voltage: 1.65 V to 3.6 V
  • Meets All Requirements of the IC-USB Standard
  • Small Packages: WCSP
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Ioff Supports Partial-Power-Down Mode Operation
  • ESD Performance
    • A port (Host-Side)
      • 2000-V Human-Body Model
      • 100-V Machine Model
      • 500-V Charged-Device Model
    • B port (Peripheral-Side)
      • >4kV HBM

The TXS0202 is a 2-bit voltage level translator optimized for use in Interchip USB (IC-USB) applications. VCCA and VCCB can each operate over the full range of 1.65 V to 3.6 V. The device has been designed to maintain cross-over skew to be less than 1 ns. The device has integrated pull-ups and pull-down resistors to aid in the protocol communication between a host and a peripheral. The translator is a buffered auto-direction sensing type translator. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The TXS0202 is a 2-bit voltage level translator optimized for use in Interchip USB (IC-USB) applications. VCCA and VCCB can each operate over the full range of 1.65 V to 3.6 V. The device has been designed to maintain cross-over skew to be less than 1 ns. The device has integrated pull-ups and pull-down resistors to aid in the protocol communication between a host and a peripheral. The translator is a buffered auto-direction sensing type translator. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet A Inter Chip-USB VOLTAGE LEVEL TRANSLATOR datasheet (Rev. A) 27 Jun 2011
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
More literature Voltage-Level Translation Guide (Rev. H) 31 Aug 2015
User guide TXS0202 Evaluation Module 24 Jun 2011

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

TXS0202EVM — TXS0202-Evaluierungsmodul

The TXS0202 EVM was created to allow simplified evaluation and prototyping without the need for full board development. This EVM provides peripheral header style pads for probing and signal connection to each device pin. Headers are labeled with the corresponding pin number.

Benutzerhandbuch: PDF
Simulationsmodell

TXS0202 IBIS Model

SLEM002.ZIP (27 KB) - IBIS Model
Gehäuse Pins Herunterladen
DSBGA (YZP) 8 Optionen anzeigen

Bestellen & Qualität

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  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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