Detalles del producto

Technology family HC Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog Supply current (max) (µA) 160
Technology family HC Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog Supply current (max) (µA) 160
PDIP (N) 16 181.42 mm² 19.3 x 9.4 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Select One of Eight Data Outputs
    • Active Low for CD74HC137 and CD74HCT137
    • Active High for ’HC237 and CD74HCT237
  • I/O Port or Memory Selector
  • Two Enable Inputs to Simplify Cascading
  • Typical Propagation Delay of 13ns at VCC = 5V, 15pF, TA = 25°C (CD74HC237)
  • Fanout (Over Temperature Range)
    • Standard Outputs. . . . 10 LSTTL Loads
    • Bus Driver Outputs. . . . 15 LSTTL Loads
  • Wide Operating Temperature Range . . . –55°C to 125°C
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • HC Types
    • 2V to 6V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30%, of VCC at VCC = 5V
  • HCT Types
    • 4.5V to 5.5V Operation
    • Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
    • CMOS Input Compatibility, Il 1µA at VOL, VOH

Data sheet acquired from Harris Semiconductor

  • Select One of Eight Data Outputs
    • Active Low for CD74HC137 and CD74HCT137
    • Active High for ’HC237 and CD74HCT237
  • I/O Port or Memory Selector
  • Two Enable Inputs to Simplify Cascading
  • Typical Propagation Delay of 13ns at VCC = 5V, 15pF, TA = 25°C (CD74HC237)
  • Fanout (Over Temperature Range)
    • Standard Outputs. . . . 10 LSTTL Loads
    • Bus Driver Outputs. . . . 15 LSTTL Loads
  • Wide Operating Temperature Range . . . –55°C to 125°C
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • HC Types
    • 2V to 6V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30%, of VCC at VCC = 5V
  • HCT Types
    • 4.5V to 5.5V Operation
    • Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
    • CMOS Input Compatibility, Il 1µA at VOL, VOH

Data sheet acquired from Harris Semiconductor

The CD74HC137, CD74HCT137, ’HC237, and CD74HCT237 are high speed silicon gate CMOS decoders well suited to memory address decoding or data routing applications. Both circuits feature low power consumption usually associated with CMOS circuitry, yet have speeds comparable to low power Schottky TTL logic.

Both circuits have three binary select inputs (A0, A1 and A2) that can be latched by an active High Latch Enable (LE) signal to isolate the outputs from select-input changes. A "Low" LE makes the output transparent to the input and the circuit functions as a one-of-eight decoder. Two Output Enable inputs (OE\1 and OE0) are provided to simplify cascading and to facilitate demultiplexing. The demultiplexing function is accomplished by using the A0, A1, A2 inputs to select the desired output and using one of the other Output Enable inputs as the data input while holding the other Output Enable input in its active state. In the CD74HC137 and CD74HCT137 the selected output is a "Low"; in the ’HC237 and CD74HCT237 the selected output is a "High".

The CD74HC137, CD74HCT137, ’HC237, and CD74HCT237 are high speed silicon gate CMOS decoders well suited to memory address decoding or data routing applications. Both circuits feature low power consumption usually associated with CMOS circuitry, yet have speeds comparable to low power Schottky TTL logic.

Both circuits have three binary select inputs (A0, A1 and A2) that can be latched by an active High Latch Enable (LE) signal to isolate the outputs from select-input changes. A "Low" LE makes the output transparent to the input and the circuit functions as a one-of-eight decoder. Two Output Enable inputs (OE\1 and OE0) are provided to simplify cascading and to facilitate demultiplexing. The demultiplexing function is accomplished by using the A0, A1, A2 inputs to select the desired output and using one of the other Output Enable inputs as the data input while holding the other Output Enable input in its active state. In the CD74HC137 and CD74HCT137 the selected output is a "Low"; in the ’HC237 and CD74HCT237 the selected output is a "High".

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Documentación técnica

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Tipo Título Fecha
* Data sheet CD74HC137, CD74HCT137, CD54HC237, CD74HC237, CD74HCT237 datasheet (Rev. F) 13 oct 2003
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 01 may 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 abr 1996

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

14-24-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados D, DB, DGV, DW, DYY, NS y PW de

El módulo de evaluación 14-24-LOGIC-EVM (EVM) está diseñado para admitir cualquier dispositivo lógico que esté en un encapsulado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.

Guía del usuario: PDF | HTML
Paquete Pasadores Descargar
PDIP (N) 16 Ver opciones
TSSOP (PW) 16 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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