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Microcontroladores (MCU) y procesadores
Procesadores basados en Arm

DM3730

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Procesador de medios digitales

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DM3730

ACTIVO
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Detalles del producto

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging
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Asistencia de diseño limitada de TI disponible

Este producto tiene un soporte de diseño de TI y limitado para proyectos existentes. Si está disponible, encontrará material adicional, software y herramientas relevantes en la página del producto. Para los diseños existentes que utilizan este producto, puede solicitar soporte en la sección TI E2ETM foros de soporte, aunque el soporte disponible para este producto es limitado.

Documentación técnica

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Tipo Título Fecha
* Data sheet DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 11 abr 2011
* Errata DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 13 feb 2014
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 24 sep 2012
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 20 mar 2019
More literature Ethernet Connectivity via GPMC 06 jul 2018
More literature AM37x/DM37x Schematic Checklist 06 jul 2018
More literature AM37x EVM Software Developer's Guide 06 jul 2018
Technical article Enabling Wi-Fi® and Bluetooth® connectivity on RTOS PDF | HTML 13 abr 2016
Technical article Spring has sprung. A sale has sprung. PDF | HTML 04 abr 2016
Application note Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 13 ago 2015
Technical article Selecting the right processor: WiLink 8 plug and play platforms PDF | HTML 26 jun 2015
Application note PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 01 nov 2013
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 10 sep 2012
More literature DM37x Design Network Partners 05 jun 2012
Application note TI OMAP4430 POP SMT Design Guideline (Rev. C) 03 nov 2011
Application note Introduction to TMS320C6000 DSP Optimization 06 oct 2011
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 15 jun 2011
Product overview DM3730 Product Bulletin 07 sep 2010
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 23 jun 2010
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 23 jun 2010
Application note AM/DM37x Power Estimation Spreadsheet 07 jun 2010
Application note AM/DM37x Overview 03 jun 2010
Application note AM3715/03 Memory Subsystem 03 jun 2010
Application note AM37x CUS Routing Guidelines 03 jun 2010
Application note Setting up AM37x SDRC Registers 03 jun 2010
User guide Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 23 may 2005
Application note AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 01 may 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Kit de desarrollo de software (SDK)

ANDROIDEVKIT-FROYO — Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Procesadores basados en Arm
DM3725 — Procesador de medios digitales DM3730 — Procesador de medios digitales
Opciones de descarga
Kit de desarrollo de software (SDK)

ANDROIDEVKIT-GINGERBREAD — Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Procesadores basados en Arm
DM3725 — Procesador de medios digitales DM3730 — Procesador de medios digitales
Opciones de descarga
Kit de desarrollo de software (SDK)

LINUXDVSDK-DM37X — Kit de desarrollo de software de video digital (DVSDK) Linux para procesadores de medios digitales D

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)
Ver opciones
Controlador o biblioteca

TELECOMLIB — Bibliotecas de telecomunicaciones y medios: FAXLIB, VoLIB y AEC/AER para procesadores TMS320C64x+ y

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

Productos y hardware compatibles

Productos y hardware compatibles

Este recurso de diseño es compatible con la mayoría de los productos de estas categorías.

Revise la página de detalles del producto para verificar la compatibilidad.
Iniciar Opciones de descarga
Herramienta de programación de software

FLASHTOOL — FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Procesadores basados en Arm
AM3505 — Procesador Sitara: ARM Cortex-A8, frontal de video AM3517 — Procesador Sitara: ARM Cortex-A8, gráficos 3D, frontal de video AM3703 — Procesador Sitara: Arm Cortex-A8, cámara AM3715 — Procesador Sitara: Arm Cortex-A8, gráficos 3D, cámara DM3725 — Procesador de medios digitales DM3730 — Procesador de medios digitales OMAP3503 — Procesador Sitara: Arm Cortex-A8, LPDDR OMAP3515 — Procesador Sitara: Arm Cortex-A8, gráficos 3D, LPDDR OMAP3525 — Procesador de aplicaciones OMAP3530 — Procesador de aplicaciones
Opciones de descarga
Modelo de simulación

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
Descargar
Modelo de simulación

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
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Modelo de simulación

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
Descargar
Modelo de simulación

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
Descargar
Modelo de simulación

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
Descargar
Modelo de simulación

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
Descargar
Herramienta de diseño

PROCESSORS-3P-SEARCH — MPU basada en Arm, MCU basada en Arm y herramienta de búsqueda de terceros DSP

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
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Diseños de referencia

TIDA-00408 — Diseño de referencia de respuesta háptica de pantalla táctil capacitiva para aplicaciones médicas y

The TIDA-00408 Touch Display with Haptic Feedback reference design showcases haptics for thermostats, building automation, factory automation, point of sale, and automotive applications.  The touch screen provides touch feedback when the user interacts with the on-screen user interface.  (...)
Design guide: PDF
Esquema: PDF
Paquete Pasadores Descargar
FCCSP (CBC) 515 Ver opciones
FCCSP (CBP) 515 Ver opciones
FCCSP (CUS) 423 Ver opciones
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

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