Inicio Lógica y traducción de voltaje Configurable & programmable logic ICs Programmable logic arrays (PLA)
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Configurable & programmable logic ICs
Programmable logic arrays (PLA)

TIBPAL16R8-30M

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TIBPAL16R8-30M

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Detalles del producto

Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 30 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 30 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • High-Performance Operation:
    Propagation Delay
    C Suffix . . . 25 ns Max
    M Suffix . . . 30 ns Max
  • Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A,
    PAL16R6A, and PAL16R8A
  • Power-Up Clear on Registered Devices (All Register Outputs Are
    Set High, but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability

IMPACT is a trademark of Texas Instruments.
PAL is a registered trademark of Advanced Micro Devices Inc.
  • High-Performance Operation:
    Propagation Delay
    C Suffix . . . 25 ns Max
    M Suffix . . . 30 ns Max
  • Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A,
    PAL16R6A, and PAL16R8A
  • Power-Up Clear on Registered Devices (All Register Outputs Are
    Set High, but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability

IMPACT is a trademark of Texas Instruments.
PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.
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Documentación técnica

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Tipo Título Fecha
* Data sheet Low-Power High-Performance IMPACT PAL Circuits datasheet (Rev. A) 05 ene 2011
* SMD TIBPAL16R8-30M SMD 5962-85155 21 jun 2016

Diseño y desarrollo

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Paquete Pasadores Descargar
CDIP (J) 20 Ver opciones
CFP (W) 20 Ver opciones
LCCC (FK) 20 Ver opciones
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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