TIBPAL20L8-20M

ACTIVO

Circuitos de alto rendimiento Impact PAL

Detalles del producto

Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (JT) 24 221.44 mm² 32 x 6.92 LCCC (FD) 28 130.6449 mm² 11.43 x 11.43 LCCC (FK) 28 130.6449 mm² 11.43 x 11.43
  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet HighPerformance Impact Programmable Array Logic Circuits datasheet (Rev. A) 05 ene 2011

Diseño y desarrollo

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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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