Detalles del producto

Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 120 CON (typ) (pF) 4.3 ON-state leakage current (max) (µA) 0.0004 Supply current (typ) (µA) 17 Bandwidth (MHz) 400 Operating temperature range (°C) -40 to 125 Features Break-before-make, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 120 CON (typ) (pF) 4.3 ON-state leakage current (max) (µA) 0.0004 Supply current (typ) (µA) 17 Bandwidth (MHz) 400 Operating temperature range (°C) -40 to 125 Features Break-before-make, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
SOT-23 (DCN) 8 4.64 mm² 2.9 x 1.6
  • Wide Supply Range: ±5 V to ±16.5 V (Dual) or 10 V to 16.5 V (Single)
  • Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
  • Low On-Capacitance: 6.4 pF
  • Low Input Leakage: 0.5 pA
  • Low Charge Injection: 0.19 pC
  • Rail-to-Rail Operation
  • Low On-Resistance: 120 Ω
  • Transition Time: 68 ns
  • Break-Before-Make Switching Action
  • EN Pin and SEL Pin Connectable to VDD with Integrated Pull-down
  • Logic Levels: 2 V to VDD
  • Low Supply Current: 17 µA
  • Human Body Model (HBM) ESD Protection: ±2 kV on All Pins
  • Industry-Standard SOT-23 Package
  • Wide Supply Range: ±5 V to ±16.5 V (Dual) or 10 V to 16.5 V (Single)
  • Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
  • Low On-Capacitance: 6.4 pF
  • Low Input Leakage: 0.5 pA
  • Low Charge Injection: 0.19 pC
  • Rail-to-Rail Operation
  • Low On-Resistance: 120 Ω
  • Transition Time: 68 ns
  • Break-Before-Make Switching Action
  • EN Pin and SEL Pin Connectable to VDD with Integrated Pull-down
  • Logic Levels: 2 V to VDD
  • Low Supply Current: 17 µA
  • Human Body Model (HBM) ESD Protection: ±2 kV on All Pins
  • Industry-Standard SOT-23 Package

The TMUX6119 is a modern complementary metal-oxide semiconductor (CMOS) single-pole, double throw (SPDT) switch. The device works well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. Both digital input pins (EN and SEL) have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL/ CMOS logic compatibility.

The TMUX6119 can be enabled or disabled by controlling the EN pin. When disabled, both channel switches are off. When enabled, the SEL pin can be used to turn on channel A (SA to D) or channel B (SB to D). Each channel conducts equally well in both directions and has an input signal range that extends to the supplies. The switches of TMUX6119 exhibit break-before-make (BBM) switching action.

The TMUX6119 is part of Texas Instruments Precision Switches and Multiplexers family. The TMUX6119 has very low leakage currents and charge injection, allowing the device to be used in high precision measurement applications. The device also provides excellent isolation capability by blocking signal levels up to the supplies when the switches are in the OFF position. A low supply current of 17 µA enables usage in portable applications.

The TMUX6119 is a modern complementary metal-oxide semiconductor (CMOS) single-pole, double throw (SPDT) switch. The device works well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. Both digital input pins (EN and SEL) have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL/ CMOS logic compatibility.

The TMUX6119 can be enabled or disabled by controlling the EN pin. When disabled, both channel switches are off. When enabled, the SEL pin can be used to turn on channel A (SA to D) or channel B (SB to D). Each channel conducts equally well in both directions and has an input signal range that extends to the supplies. The switches of TMUX6119 exhibit break-before-make (BBM) switching action.

The TMUX6119 is part of Texas Instruments Precision Switches and Multiplexers family. The TMUX6119 has very low leakage currents and charge injection, allowing the device to be used in high precision measurement applications. The device also provides excellent isolation capability by blocking signal levels up to the supplies when the switches are in the OFF position. A low supply current of 17 µA enables usage in portable applications.

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Documentación técnica

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* Data sheet TMUX6119 ±16.5-V, Low Capacitance, Low-Leakage-Current, Precision, SPDT Switch datasheet (Rev. A) PDF | HTML 11 dic 2018
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 dic 2021
Application note System Level Protection for High Voltage Analog Multiplexers 03 ene 2017

Diseño y desarrollo

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Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Modelo de simulación

TMUX6119 IBIS Model

SCDM205.ZIP (14 KB) - IBIS Model
Paquete Pasadores Descargar
SOT-23 (DCN) 8 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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