TPA152

ACTIVO

Amplificador de auriculares estéreo de entrada analógica y 75 mW

Detalles del producto

Output power (W) 0.075 Analog supply (min) (V) 4.5 Analog supply voltage (max) (V) 5.5 Load (min) (Ω) 32 PSRR (dB) 81 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control No Architecture Class-AB Iq per channel (typ) (mA) 2.8
Output power (W) 0.075 Analog supply (min) (V) 4.5 Analog supply voltage (max) (V) 5.5 Load (min) (Ω) 32 PSRR (dB) 81 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control No Architecture Class-AB Iq per channel (typ) (mA) 2.8
SOIC (D) 8 29.4 mm² 4.9 x 6
  • High-Fidelity Line-Out/HP Driver
  • 75-mW Stereo Output
  • PC Power Supply Compatible
  • Pop Reduction Circuitry
  • Internal Mid-Rail Generation
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
  • Pin Compatible With TPA302
  • High-Fidelity Line-Out/HP Driver
  • 75-mW Stereo Output
  • PC Power Supply Compatible
  • Pop Reduction Circuitry
  • Internal Mid-Rail Generation
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
  • Pin Compatible With TPA302

The TPA152 is a stereo audio power amplifier capable of less than 0.1% THD+N at 1 kHz when delivering 75 mW per channel into a 32- loads, the THD+N performance is better than 0.005% at 1 kHz, and less than 0.01% across the audio band of 20 to 20 kHz.

The TPA152 is ideal for use as an output buffer for the audio CODEC in PC systems. It is also excellent for use where a high-performance head phone/line-out amplifier is needed. Depop circuitry is integrated to reduce transients during power up, power down, and mute mode.

Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 1 to 10. The TPA152 is packaged in the 8-pin SOIC (D) package that reduces board space and facilitates automated assembly.

The TPA152 is a stereo audio power amplifier capable of less than 0.1% THD+N at 1 kHz when delivering 75 mW per channel into a 32- loads, the THD+N performance is better than 0.005% at 1 kHz, and less than 0.01% across the audio band of 20 to 20 kHz.

The TPA152 is ideal for use as an output buffer for the audio CODEC in PC systems. It is also excellent for use where a high-performance head phone/line-out amplifier is needed. Depop circuitry is integrated to reduce transients during power up, power down, and mute mode.

Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 1 to 10. The TPA152 is packaged in the 8-pin SOIC (D) package that reduces board space and facilitates automated assembly.

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Documentación técnica

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Tipo Título Fecha
* Data sheet 75-mW Stereo Audio Power Amplifier datasheet (Rev. A) 15 mar 2000
Application note Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 26 ago 2019
Application note AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 27 jun 2019
User guide TPA152EVM - User Guide 14 abr 1998

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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SOIC (D) 8 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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