TPA2000D4

ACTIVO

Amplificador de audio estéreo de Clase D, entrada analógica y 2 W, con amplificador para auriculares

Detalles del producto

Rating Catalog Load (min) (Ω) 4 Output power (W) 2 PSRR (dB) 70 Operating temperature range (°C) -40 to 85
Rating Catalog Load (min) (Ω) 4 Output power (W) 2 PSRR (dB) 70 Operating temperature range (°C) -40 to 85
HTSSOP (DAP) 32 89.1 mm² 11 x 8.1
  • Ideal for Notebook PCs and USB-Powered Speakers
  • 2 W Into 4 From 5-V Supply
  • Integrated Class-AB Headphone Amplifier
  • Second-Generation Modulation Technique
    • Filterless Operation
    • Improved Efficiency
  • Low Supply Current...9 mA typ at 5 V
  • Shutdown Control...< 0.05 µA Typ
  • Shutdown Pin Is TTL Compatible
  • –40°C to 85°C Operating Temperature Range
  • Space-Saving, Thermally-Enhanced PowerPAD™ Packaging

PowerPAD is a trademark of Texas Instruments.

  • Ideal for Notebook PCs and USB-Powered Speakers
  • 2 W Into 4 From 5-V Supply
  • Integrated Class-AB Headphone Amplifier
  • Second-Generation Modulation Technique
    • Filterless Operation
    • Improved Efficiency
  • Low Supply Current...9 mA typ at 5 V
  • Shutdown Control...< 0.05 µA Typ
  • Shutdown Pin Is TTL Compatible
  • –40°C to 85°C Operating Temperature Range
  • Space-Saving, Thermally-Enhanced PowerPAD™ Packaging

PowerPAD is a trademark of Texas Instruments.

The TPA2000D4 is a 2-W stereo bridge-tied-load (BTL) class-D amplifier designed to drive speakers with as low as 4- impedance. The amplifier uses TI’s second-generation modulation technique, which results in improved efficiency and SNR, and also allows the device to be connected directly to the speaker without the use of the LC output filter commonly associated with class-D amplifiers (this will result in an EMI which must be shielded at the system level). These features make the device ideal for use in notebook PCs where high-efficiency is needed to extend battery run-time. For speakers powered off the USB bus, the high-efficiency allows for higher output power levels without tripping the USB’s over-current circuitry.

The gain of the amplifier is controlled by two input terminals, GAIN1, and GAIN0. This allows the amplifier to be configured for a gain of 5, 11, 17 and 23 dB. The differential input terminals are high-impedance CMOS inputs, and can be used as summing nodes.

The headphone amplifier is a stereo single-ended (SE) class-AB amplifier which requires two external resistors per channel to set the gain. The MODE pin selects which amplifier is active; the unused amplifier is placed in shutdown to reduce supply current.

Both the class-D BTL amplifier, and the class-AB SE amplifier include depop circuitry to reduce the amount of turnon pop at power up, when cycling SHUTDOWN\, and when switching modes of operation.

The TPA2000D4 is available in the 32-pin thermally-enhanced TSSOP package (DAP) which allows stereo 2-W continuous output power levels in 4- loads when placed on a board with proper thermal board design. The TPA2000D4 operates over an ambient temperature range of –40°C to 85°C.

These packages deliver levels of thermal performance that were previously only achievable in TO-220-type packages. Thermal impedances of less than 35°C/W are readily realized in multilayer PCB applications when using the DAP package.

The TPA2000D4 is a 2-W stereo bridge-tied-load (BTL) class-D amplifier designed to drive speakers with as low as 4- impedance. The amplifier uses TI’s second-generation modulation technique, which results in improved efficiency and SNR, and also allows the device to be connected directly to the speaker without the use of the LC output filter commonly associated with class-D amplifiers (this will result in an EMI which must be shielded at the system level). These features make the device ideal for use in notebook PCs where high-efficiency is needed to extend battery run-time. For speakers powered off the USB bus, the high-efficiency allows for higher output power levels without tripping the USB’s over-current circuitry.

The gain of the amplifier is controlled by two input terminals, GAIN1, and GAIN0. This allows the amplifier to be configured for a gain of 5, 11, 17 and 23 dB. The differential input terminals are high-impedance CMOS inputs, and can be used as summing nodes.

The headphone amplifier is a stereo single-ended (SE) class-AB amplifier which requires two external resistors per channel to set the gain. The MODE pin selects which amplifier is active; the unused amplifier is placed in shutdown to reduce supply current.

Both the class-D BTL amplifier, and the class-AB SE amplifier include depop circuitry to reduce the amount of turnon pop at power up, when cycling SHUTDOWN\, and when switching modes of operation.

The TPA2000D4 is available in the 32-pin thermally-enhanced TSSOP package (DAP) which allows stereo 2-W continuous output power levels in 4- loads when placed on a board with proper thermal board design. The TPA2000D4 operates over an ambient temperature range of –40°C to 85°C.

These packages deliver levels of thermal performance that were previously only achievable in TO-220-type packages. Thermal impedances of less than 35°C/W are readily realized in multilayer PCB applications when using the DAP package.

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Documentación técnica

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Tipo Título Fecha
* Data sheet Stereo 2-W Class-D Audio Power Amplifier with Stereo HP Amplifier datasheet (Rev. B) 07 nov 2005
Application note Layout Guidelines For TPA300x Series Parts (Rev. A) 24 jun 2020
Application note Measuring Class-D Amplifiers for Audio Speaker Overstress Testing 28 oct 2005
User guide TPA2000D4EVM - User Guide (Rev. A) 06 abr 2001

Diseño y desarrollo

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Herramienta de simulación

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PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Paquete Pasadores Descargar
HTSSOP (DAP) 32 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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