Detalles del producto

Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 3 CON (typ) (pF) 160 Supply current (typ) (µA) 10 Bandwidth (MHz) 25 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 100 Rating Catalog Drain supply voltage (max) (V) 5.25 Supply voltage (max) (V) 5.25
Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 3 CON (typ) (pF) 160 Supply current (typ) (µA) 10 Bandwidth (MHz) 25 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 100 Rating Catalog Drain supply voltage (max) (V) 5.25 Supply voltage (max) (V) 5.25
SSOP (DBQ) 16 29.4 mm² 4.9 x 6
  • Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 3 Typ)
  • 0- to 10-V Switching on Data I/O Ports
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 20 pF Max, B Port)
  • VCC Operating Range From 4.75 V to 5.25 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications
  • APPLICATIONS
    • PCI Interface
    • Differential Signal Interface
    • Memory Interleaving
    • Bus Isolation
    • Low-Distortion Signal Gating

  • Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 3 Typ)
  • 0- to 10-V Switching on Data I/O Ports
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 20 pF Max, B Port)
  • VCC Operating Range From 4.75 V to 5.25 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications
  • APPLICATIONS
    • PCI Interface
    • Differential Signal Interface
    • Memory Interleaving
    • Bus Isolation
    • Low-Distortion Signal Gating

The TS5N118 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the TS5N118 provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems.

The TS5N118 is a 1-of-8 multiplexer/demultiplexer with a single output-enable (OE) input. The select (S0, S1, S2) inputs control the data path of the multiplexer/demultiplexer. When OE is low, the multiplexer/demultiplexer is enabled and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the multiplexer/demultiplexer is disabled and a high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The TS5N118 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the TS5N118 provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems.

The TS5N118 is a 1-of-8 multiplexer/demultiplexer with a single output-enable (OE) input. The select (S0, S1, S2) inputs control the data path of the multiplexer/demultiplexer. When OE is low, the multiplexer/demultiplexer is enabled and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the multiplexer/demultiplexer is disabled and a high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TS5N118 datasheet 28 jul 2005
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 dic 2021
Application note Preventing Excess Power Consumption on Analog Switches 03 jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Paquete Pasadores Descargar
SSOP (DBQ) 16 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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