OPA377-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified with the Following Results:
- Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
Range - Device HBM ESD Classification Level 3A
- Device CDM ESD Classification Level C6
- Device Temperature Grade 1: –40°C to
- Low Noise: 7.5 nV/√Hz at 1 kHz
- 0.1-Hz to 10-Hz Noise: 0.8 µVPP
- Quiescent Current: 760 µA (typical)
- Low Offset Voltage: 250 µV (typical)
- Gain Bandwidth Product: 5.5 MHz
- Rail-to-Rail Input and Output
- Single-Supply Operation
- Supply Voltage: 2.2 V to 5.5 V
- Space-Saving Packages:
- SOT-23, VSSOP, TSSOP
The OPAx377-Q1 family of operational amplifiers are wide-bandwidth CMOS amplifiers that provide very low noise, low input bias current, and low offset voltage while operating on a low quiescent current of 0.76 mA (typical).
The OPAx377-Q1 op amps are optimized for low-voltage, single-supply applications. The exceptional combination of ac and dc performance make them ideal for a wide range of applications, including small signal conditioning, audio, and active filters. In addition, these parts have a wide supply range with excellent PSRR, making them attractive for applications that run directly from batteries without regulation.
The OPA377-Q1 is available in the SOT23-5 package. The dual, OPA2377-Q1, is offered in the MSOP-8 package and the quad OPA4377-Q1 is offered in the TSSOP-14 package. All versions are specified for operation from –40°C to +125°C.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | OPAx377-Q1 Low-Noise, Low Quiescent Current, Precision Automotive Grade Operational Amplifier datasheet (Rev. A) | PDF | HTML | 2016/05/25 |
Application note | Ramping Up on Slew Rate | PDF | HTML | 2023/07/13 | |
Functional safety information | OPA377-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA | PDF | HTML | 2020/09/28 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017/03/28 |
설계 및 개발
데스크톱에서 설계 및 개발 섹션을 확인하세요.주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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