홈 로직 및 전압 변환 Configurable & programmable logic ICs Programmable logic arrays (PLA)
홈
로직 및 전압 변환
Configurable & programmable logic ICs
Programmable logic arrays (PLA)

PAL16R6AM

활성

표준 고속 PAL 회로

지금 주문
데이터시트

PAL16R6AM

활성
데이터시트 지금 주문

제품 상세 정보

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 25 Supply current (max) (µA) 180000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 25 Supply current (max) (µA) 180000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Choice of Operating Speeds
    • High-Speed, A Devices . . . 25 MHz Min
    • Half-Power, A-2 Devices . . . 16 MHz Min
  • Choice of Input/Output Configuration
  • Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
    • DEVICE
    		I
    INPUTS
    		 3-STATE
    O OUTPUTS
    		 REGISTERED
    Q OUTPUTS
    		 I/O
    PORT
    S
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    PAL is a registered trademark of Advanced Micro Devices Inc.
  • Choice of Operating Speeds
    • High-Speed, A Devices . . . 25 MHz Min
    • Half-Power, A-2 Devices . . . 16 MHz Min
  • Choice of Input/Output Configuration
  • Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
    • DEVICE
    		I
    INPUTS
    		 3-STATE
    O OUTPUTS
    		 REGISTERED
    Q OUTPUTS
    		 I/O
    PORT
    S
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.

The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.

The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

open-in-new 기타 Programmable logic arrays (PLA) 찾기
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기술 문서

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모두 보기2
유형 직함 날짜
* Data sheet Standard High-Speed Programmable Array Logic Circuits datasheet 1992/03/01
* SMD PAL16R6AM SMD 81036092A 2016/06/21

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

패키지 핀 다운로드
CDIP (J) 20 옵션 보기
LCCC (FK) 20 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

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