홈 로직 및 전압 변환 Configurable & programmable logic ICs Programmable logic arrays (PLA)
홈
로직 및 전압 변환
Configurable & programmable logic ICs
Programmable logic arrays (PLA)

TIBPAL16R4-15M

새 설계에 권장하지 않음

고성능 Impact PAL 회로

지금 주문
데이터시트

TIBPAL16R4-15M

새 설계에 권장하지 않음
데이터시트 지금 주문

제품 상세 정보

Rating Military Operating temperature range (°C) -55 to 125
Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • High-Performance Operation: Propagation Delay . . . 15 ns Max
  • Power-Up Clear on Registered Devices (All Register Outputs are Set High,
    but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs
  • Dependable Texas Instruments Quality and Reliability

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.
  • High-Performance Operation: Propagation Delay . . . 15 ns Max
  • Power-Up Clear on Registered Devices (All Register Outputs are Set High,
    but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs
  • Dependable Texas Instruments Quality and Reliability

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

IMPORTANT PROGAMMING NOTE: For TIBPAL16L8-15M devices in J, W, or FK packages - For date code 9903A or later device programming, select from either TI Military/16L8-12 or TI commercial TI/16L8-10 on the Manufacturer/Device menu listing in your programming system.

IMPORTANT PROGAMMING NOTE: For TIBPAL16R4-15M devices in J, W, or FK packages - For date code 9616A or later device programming, select from either TI Military/16R4-12 or TI commercial TI /16R4-10 on the Manufacturer/Device menu listing in your programming system.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

IMPORTANT PROGAMMING NOTE: For TIBPAL16L8-15M devices in J, W, or FK packages - For date code 9903A or later device programming, select from either TI Military/16L8-12 or TI commercial TI/16L8-10 on the Manufacturer/Device menu listing in your programming system.

IMPORTANT PROGAMMING NOTE: For TIBPAL16R4-15M devices in J, W, or FK packages - For date code 9616A or later device programming, select from either TI Military/16R4-12 or TI commercial TI /16R4-10 on the Manufacturer/Device menu listing in your programming system.
open-in-new 기타 Programmable logic arrays (PLA) 찾기
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기술 문서

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모두 보기2
유형 직함 날짜
* Data sheet High-Performance Impact Programmable Array Logic Circuits.. datasheet (Rev. B) 2011/11/02
* SMD TIBPAL16R4-15M SMD 5962-85155 2016/06/21

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

패키지 핀 다운로드
CDIP (J) 20 옵션 보기
CFP (W) 20 옵션 보기
LCCC (FK) 20 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

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