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Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 1000 CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Ethernet MAC 1-Port 10/100/1000 PCIe 1 PCIe Gen 2 Hardware accelerators SGX530 Graphics Operating system DSP/BIOS, Linux Rating Catalog Power supply solution TPS65050 Operating temperature range (°C) 0 to 90
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 1000 CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Ethernet MAC 1-Port 10/100/1000 PCIe 1 PCIe Gen 2 Hardware accelerators SGX530 Graphics Operating system DSP/BIOS, Linux Rating Catalog Power supply solution TPS65050 Operating temperature range (°C) 0 to 90
FCBGA (CYE) 684 529 mm² 23 x 23
  • High-Performance DaVinci Video Processors
    • Up to 1-GHz ARM® Cortex®-A8 RISC Core
    • Up to 750-MHz C674x™ VLIW DSP
    • Up to 6000 MIPS and 4500 MFLOPS
    • Fully Software-Compatible with C67x+™, C64x+™
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • In-Order, Dual-Issue, Superscalar Processor Core
      • Neon™ Multimedia Architecture
      • Supports Integer and Floating Point
      • Jazelle® RCT Execution Environment
  • ARM Cortex-A8 Memory Architecture
    • 32KB of Instruction and Data Caches
    • 512KB of L2 Cache
    • 64KB of RAM, 48KB of Boot ROM
  • TMS320C674x Floating-Point VLIW DSP
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Adds Per Clock and Four DP Adds Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Approximate Reciprocal or Square Root Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP x SP → SP Per Clock
        • 2 SP x SP → DP Every Two Clocks
        • 2 SP x DP → DP Every Three Clocks
        • 2 DP x DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32 Multiplies, Four 16 x 16-Bit Multiplies Including Complex Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle
  • C674x Two-Level Memory Architecture
    • 32KB of L1P RAM/Cache With EDC
    • 32KB of L1D RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Caches With ECC
  • System Memory Management Unit (MMU)
    • Maps C674x DSP and EDMA TC Memory Accesses to System Addresses
  • 128KB of On-Chip Memory Controller (OCMC) RAM
  • Imaging Subsystem (ISS)
    • Camera Sensor Connection
      • Parallel Connection for Raw (up to 16-Bit) and BT.656 or BT.1120 (8- and 16-Bit)
    • Image Sensor Interface (ISIF) for Handling Image and Video Data From the Camera Sensor
    • Resizer
      • Resizing Image and Video From 1/16x to 8x
      • Generating Two Different Resizing Outputs Concurrently
  • Programmable High-Definition Video Image Coprocessing (HDVICP v2) Engine
    • Encode, Decode, Transcode Operations
    • H.264, MPEG-2, VC-1, MPEG-4, SP/ASP, JPEG/MJPEG
  • Media Controller
    • Controls the HDVPSS, HDVICP2, and ISS
  • SGX530 3D Graphics Engine
    • Delivers up to 25 MPoly/sec
    • Universal Scalable Shader Engine
    • Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, OpenMax API Support
    • Advanced Geometry DMA Driven Operation
    • Programmable HQ Image Anti-Aliasing
  • Endianness
    • ARM and DSP Instructions/Data – Little Endian
  • HD Video Processing Subsystem (HDVPSS)
    • Two 165-MHz, 2-channel HD Video Capture Modules
      • One 16-/24-Bit Input or Dual 8-Bit SD Input Channels
      • One 8-/16-/24-Bit Input and One 8-Bit Only Input Channels
    • Two 165-MHz HD Video Display Outputs
      • One 16-, 24-, or 30-Bit Output and One 16- or 24-Bit Output
    • Composite or S-Video Analog Output
    • Macrovision® Support Available
    • Digital HDMI 1.3 Transmitter With Integrated PHY
    • Advanced Video Processing Features Such as Scan, Format, Rate Conversion
    • Three Graphics Layers and Compositors
  • Dual 32-Bit DDR2/DDR3 SDRAM Interfaces
    • Supports up to DDR2-800 and DDR3-1066
    • Up to Eight x 8 Devices Total 2GB of Total Address Space
    • Dynamic Memory Manager (DMM)
      • Programmable Multi-Zone Memory Mapping and Interleaving
      • Enables Efficient 2D Block Accesses
      • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
      • Optimizes Interlaced Accesses
  • General-Purpose Memory Controller (GPMC)
    • 8- or 16-Bit Multiplexed Address and Data Bus
    • 512MB of Address Space Divided Among up to 8 Chip Selects
    • Glueless Interface to NOR Flash, NAND Flash (BCH/Hamming Error Code Detection), SRAM and Pseudo-SRAM
    • Error Locator Module (ELM) Outside of GPMC to Provide Up to 16-Bit or 512-Byte Hardware ECC for NAND
    • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs, and so Forth
  • Enhanced Direct Memory Access (EDMA) Controller
    • Four Transfer Controllers
    • 64 Independent DMA Channels and 8 Independent QDMA Channels
  • Dual Port Ethernet (10/100/1000 Mbps) With Optional Switch
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • MII/RMII/GMII/RGMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
    • Reset Isolation
    • IEEE 1588 Time-Stamping and Industrial Ethernet Protocols
  • Dual USB 2.0 Ports With Integrated PHYs
    • USB2.0 High- and Full-Speed Clients
    • USB2.0 High-, Full-, and Low-Speed Hosts, or OTG
    • Supports End Points 0–15
  • One PCI Express 2.0 Port With Integrated PHY
    • Single Port With One Lane at 5.0 GT/s
    • Configurable as Root Complex or Endpoint
  • Eight 32-Bit General-Purpose Timers (Timer1–8)
  • One System Watchdog Timer (WDT0)
  • Six Configurable UART/IrDA/CIR Modules
    • UART0 With Modem Control Signals
    • Supports up to 3.6864 Mbps UART0/1/2
    • Supports up to 12 Mbps UART3/4/5
    • SIR, MIR, FIR (4.0 MBAUD), and CIR
  • Four Serial Peripheral Interfaces (SPIs) (up to
    48 MHz)
    • Each With Four Chip Selects
  • Three MMC/SD/SDIO Serial Interfaces (up to
    48 MHz)
    • Three Supporting up to 1-, 4-, or 8-Bit Modes
  • Dual Controller Area Network (DCAN) Modules
    • CAN Version 2 Part A, B
  • Four Inter-Integrated Circuit (I2C Bus) Ports
  • Six Multichannel Audio Serial Ports (McASPs)
    • Dual Ten Serializer Transmit and Receive Ports
    • Quad Four Serializer Transmit and Receive Ports
    • DIT-Capable For S/PDIF (All Ports)
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and Receive Clocks up to 48 MHz
    • Two Clock Zones and Two Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
  • Serial ATA (SATA) 3.0 Gbps Controller With Integrated PHY
    • Direct Interface to One Hard Disk Drive
    • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Real-Time Clock (RTC)
    • One-Time or Periodic Interrupt Generation
  • Up to 128 General-Purpose I/O (GPIO) Pins
  • One Spin Lock Module with up to 128 Hardware Semaphores
  • One Mailbox Module with 12 Mailboxes
  • On-Chip ARM ROM Bootloader (RBL)
  • Power, Reset, and Clock Management
    • Multiple Independent Core Power Domains
    • Multiple Independent Core Voltage Domains
    • Support for Three Operating Points (OPP100, OPP120, OPP166) per Voltage Domain
    • Clock Enable and Disable Control for Subsystems and Peripherals
  • 32KB of Embedded Trace Buffer (ETB) and
    5-Pin Trace Interface for Debug
  • IEEE 1149.1 (JTAG) Compatible
  • 684-Pin Pb-Free BGA Package (CYE Suffix), 0.8-mm Ball Pitch With Via Channel Technology to Reduce PCB Cost
  • 45-nm CMOS Technology
  • 1.8- and 3.3-V Dual Voltage Buffers for General I/O
  • High-Performance DaVinci Video Processors
    • Up to 1-GHz ARM® Cortex®-A8 RISC Core
    • Up to 750-MHz C674x™ VLIW DSP
    • Up to 6000 MIPS and 4500 MFLOPS
    • Fully Software-Compatible with C67x+™, C64x+™
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • In-Order, Dual-Issue, Superscalar Processor Core
      • Neon™ Multimedia Architecture
      • Supports Integer and Floating Point
      • Jazelle® RCT Execution Environment
  • ARM Cortex-A8 Memory Architecture
    • 32KB of Instruction and Data Caches
    • 512KB of L2 Cache
    • 64KB of RAM, 48KB of Boot ROM
  • TMS320C674x Floating-Point VLIW DSP
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Adds Per Clock and Four DP Adds Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Approximate Reciprocal or Square Root Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP x SP → SP Per Clock
        • 2 SP x SP → DP Every Two Clocks
        • 2 SP x DP → DP Every Three Clocks
        • 2 DP x DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32 Multiplies, Four 16 x 16-Bit Multiplies Including Complex Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle
  • C674x Two-Level Memory Architecture
    • 32KB of L1P RAM/Cache With EDC
    • 32KB of L1D RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Caches With ECC
  • System Memory Management Unit (MMU)
    • Maps C674x DSP and EDMA TC Memory Accesses to System Addresses
  • 128KB of On-Chip Memory Controller (OCMC) RAM
  • Imaging Subsystem (ISS)
    • Camera Sensor Connection
      • Parallel Connection for Raw (up to 16-Bit) and BT.656 or BT.1120 (8- and 16-Bit)
    • Image Sensor Interface (ISIF) for Handling Image and Video Data From the Camera Sensor
    • Resizer
      • Resizing Image and Video From 1/16x to 8x
      • Generating Two Different Resizing Outputs Concurrently
  • Programmable High-Definition Video Image Coprocessing (HDVICP v2) Engine
    • Encode, Decode, Transcode Operations
    • H.264, MPEG-2, VC-1, MPEG-4, SP/ASP, JPEG/MJPEG
  • Media Controller
    • Controls the HDVPSS, HDVICP2, and ISS
  • SGX530 3D Graphics Engine
    • Delivers up to 25 MPoly/sec
    • Universal Scalable Shader Engine
    • Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, OpenMax API Support
    • Advanced Geometry DMA Driven Operation
    • Programmable HQ Image Anti-Aliasing
  • Endianness
    • ARM and DSP Instructions/Data – Little Endian
  • HD Video Processing Subsystem (HDVPSS)
    • Two 165-MHz, 2-channel HD Video Capture Modules
      • One 16-/24-Bit Input or Dual 8-Bit SD Input Channels
      • One 8-/16-/24-Bit Input and One 8-Bit Only Input Channels
    • Two 165-MHz HD Video Display Outputs
      • One 16-, 24-, or 30-Bit Output and One 16- or 24-Bit Output
    • Composite or S-Video Analog Output
    • Macrovision® Support Available
    • Digital HDMI 1.3 Transmitter With Integrated PHY
    • Advanced Video Processing Features Such as Scan, Format, Rate Conversion
    • Three Graphics Layers and Compositors
  • Dual 32-Bit DDR2/DDR3 SDRAM Interfaces
    • Supports up to DDR2-800 and DDR3-1066
    • Up to Eight x 8 Devices Total 2GB of Total Address Space
    • Dynamic Memory Manager (DMM)
      • Programmable Multi-Zone Memory Mapping and Interleaving
      • Enables Efficient 2D Block Accesses
      • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
      • Optimizes Interlaced Accesses
  • General-Purpose Memory Controller (GPMC)
    • 8- or 16-Bit Multiplexed Address and Data Bus
    • 512MB of Address Space Divided Among up to 8 Chip Selects
    • Glueless Interface to NOR Flash, NAND Flash (BCH/Hamming Error Code Detection), SRAM and Pseudo-SRAM
    • Error Locator Module (ELM) Outside of GPMC to Provide Up to 16-Bit or 512-Byte Hardware ECC for NAND
    • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs, and so Forth
  • Enhanced Direct Memory Access (EDMA) Controller
    • Four Transfer Controllers
    • 64 Independent DMA Channels and 8 Independent QDMA Channels
  • Dual Port Ethernet (10/100/1000 Mbps) With Optional Switch
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • MII/RMII/GMII/RGMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
    • Reset Isolation
    • IEEE 1588 Time-Stamping and Industrial Ethernet Protocols
  • Dual USB 2.0 Ports With Integrated PHYs
    • USB2.0 High- and Full-Speed Clients
    • USB2.0 High-, Full-, and Low-Speed Hosts, or OTG
    • Supports End Points 0–15
  • One PCI Express 2.0 Port With Integrated PHY
    • Single Port With One Lane at 5.0 GT/s
    • Configurable as Root Complex or Endpoint
  • Eight 32-Bit General-Purpose Timers (Timer1–8)
  • One System Watchdog Timer (WDT0)
  • Six Configurable UART/IrDA/CIR Modules
    • UART0 With Modem Control Signals
    • Supports up to 3.6864 Mbps UART0/1/2
    • Supports up to 12 Mbps UART3/4/5
    • SIR, MIR, FIR (4.0 MBAUD), and CIR
  • Four Serial Peripheral Interfaces (SPIs) (up to
    48 MHz)
    • Each With Four Chip Selects
  • Three MMC/SD/SDIO Serial Interfaces (up to
    48 MHz)
    • Three Supporting up to 1-, 4-, or 8-Bit Modes
  • Dual Controller Area Network (DCAN) Modules
    • CAN Version 2 Part A, B
  • Four Inter-Integrated Circuit (I2C Bus) Ports
  • Six Multichannel Audio Serial Ports (McASPs)
    • Dual Ten Serializer Transmit and Receive Ports
    • Quad Four Serializer Transmit and Receive Ports
    • DIT-Capable For S/PDIF (All Ports)
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and Receive Clocks up to 48 MHz
    • Two Clock Zones and Two Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
  • Serial ATA (SATA) 3.0 Gbps Controller With Integrated PHY
    • Direct Interface to One Hard Disk Drive
    • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Real-Time Clock (RTC)
    • One-Time or Periodic Interrupt Generation
  • Up to 128 General-Purpose I/O (GPIO) Pins
  • One Spin Lock Module with up to 128 Hardware Semaphores
  • One Mailbox Module with 12 Mailboxes
  • On-Chip ARM ROM Bootloader (RBL)
  • Power, Reset, and Clock Management
    • Multiple Independent Core Power Domains
    • Multiple Independent Core Voltage Domains
    • Support for Three Operating Points (OPP100, OPP120, OPP166) per Voltage Domain
    • Clock Enable and Disable Control for Subsystems and Peripherals
  • 32KB of Embedded Trace Buffer (ETB) and
    5-Pin Trace Interface for Debug
  • IEEE 1149.1 (JTAG) Compatible
  • 684-Pin Pb-Free BGA Package (CYE Suffix), 0.8-mm Ball Pitch With Via Channel Technology to Reduce PCB Cost
  • 45-nm CMOS Technology
  • 1.8- and 3.3-V Dual Voltage Buffers for General I/O

TMS320DM814x DaVinci video processors are highly integrated, programmable platforms that leverage the DaVinci processor technology to meet the processing needs of the following applications to name a few: HD Video Conferencing - Skype endpoints Video Surveillance DVRs IP Netcam Digital Signage Media Players and Adapters Mobile Medical Imaging Network Projectors Home Audio and Video Equipment

The device enables Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The device also combines programmable video and audio processing with a highly integrated peripheral set.

The TMS320DM814x DaVinci video processors also present OEMs and ODMs with new levels of processor scalability and software reuse. An OEM or ODM that used the AM387x processors in a design and can make a similar product with added features could scale up to the pin-compatible and software-compatible TMS320DM814x processors from TI. The TMS320DM814x DaVinci video processors add a powerful C674x DSP core along with a video encoder and decoder to the hardware on the AM38x. Additionally, OEMs or ODMs that have used the AM387x or DM814x processors and find a need for a faster ARM and DSP core performance could scale up to the software-compatible AM389x or TMS320DM816x devices with higher core speeds.

Programmability is provided by an ARM Cortex-A8 RISC CPU with Neon extension, TI C674x VLIW floating-point DSP core, and high-definition video and imaging coprocessors. The ARM lets developers keep control functions separate from A/V algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software. The ARM Cortex-A8 32-Bit RISC Core with Neon floating-point extension includes: 32KB of Instruction cache; 32KB of Data cache; 512KB of L2 Cache; 48KB of Boot ROM; and 64KB of RAM.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections in this document and the associated peripheral reference guides. The peripheral set includes: HD Video Processing Subsystem Dual Port Gigabit Ethernet MACs (10/100/1000 Mbps) [Ethernet Switch] with MII/RMII/GMII/RGMII and MDIO interface supporting IEEE 1588 Time-Stamping and Industrial Ethernet ProtocolsTwo USB ports with integrated 2.0 PHY PCIe x1 GEN2 Compliant interfaceTwo 10-serializer McASP audio serial ports (with DIT mode)Four quad-serilaizer McASP audio serial ports (with DIT mode)One McBSP multichannel buffered serial portSix UARTs with IrDA and CIR supportFour SPI serial interfacesThree MMC/SD/SDIO serial interfacesFour I2C master and slave interfaces Parallel Camera Interface (CAM)Up to 128 General-Purpose I/Os (GPIOs)Eight 32-bit general-purpose timers System watchdog timer Dual DDR2, and DDR3 SDRAM interfacesFlexible 8- or 16-bit asynchronous memory interfaceTwo Controller Area Network (DCAN) modulesSpin LockMailboxSerial Hard Disk Drive Interface (SATA 300)

The TMS320DM814x DaVinci video processors also include a high-definition video and imaging coprocessor 2 (HDVICP2), and an SGX530 3D graphics engine to off-load many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. Additionally, it has a complete set of development tools for both the ARM and DSP, which include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Microsoft® Windows® debugger interface for visibility into source code execution.

The C674x DSP core is the high-performance floating-point DSP generation in the TMS320C6000 DSP platform and is code-compatible with previous generation C64x Fixed-Point and C67x Floating-Point DSP generation. The C674x Floating-Point DSP processor uses 32KB of L1 program memory with EDC and 32KB of L1 data memory. Up to 32KB of L1P can be configured as program cache. The remaining memory is noncacheable no-wait-state program memory. Up to 32KB of L1D can be configured as data cache. The remaining memory is noncacheable no-wait-state data memory. The DSP has 256KB of L2 RAM with ECC, which can be defined as SRAM, L2 cache, or a combination of both. All C674x L3 and off-chip memory accesses are routed through an MMU.

TMS320DM814x DaVinci video processors are highly integrated, programmable platforms that leverage the DaVinci processor technology to meet the processing needs of the following applications to name a few: HD Video Conferencing - Skype endpoints Video Surveillance DVRs IP Netcam Digital Signage Media Players and Adapters Mobile Medical Imaging Network Projectors Home Audio and Video Equipment

The device enables Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The device also combines programmable video and audio processing with a highly integrated peripheral set.

The TMS320DM814x DaVinci video processors also present OEMs and ODMs with new levels of processor scalability and software reuse. An OEM or ODM that used the AM387x processors in a design and can make a similar product with added features could scale up to the pin-compatible and software-compatible TMS320DM814x processors from TI. The TMS320DM814x DaVinci video processors add a powerful C674x DSP core along with a video encoder and decoder to the hardware on the AM38x. Additionally, OEMs or ODMs that have used the AM387x or DM814x processors and find a need for a faster ARM and DSP core performance could scale up to the software-compatible AM389x or TMS320DM816x devices with higher core speeds.

Programmability is provided by an ARM Cortex-A8 RISC CPU with Neon extension, TI C674x VLIW floating-point DSP core, and high-definition video and imaging coprocessors. The ARM lets developers keep control functions separate from A/V algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software. The ARM Cortex-A8 32-Bit RISC Core with Neon floating-point extension includes: 32KB of Instruction cache; 32KB of Data cache; 512KB of L2 Cache; 48KB of Boot ROM; and 64KB of RAM.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections in this document and the associated peripheral reference guides. The peripheral set includes: HD Video Processing Subsystem Dual Port Gigabit Ethernet MACs (10/100/1000 Mbps) [Ethernet Switch] with MII/RMII/GMII/RGMII and MDIO interface supporting IEEE 1588 Time-Stamping and Industrial Ethernet ProtocolsTwo USB ports with integrated 2.0 PHY PCIe x1 GEN2 Compliant interfaceTwo 10-serializer McASP audio serial ports (with DIT mode)Four quad-serilaizer McASP audio serial ports (with DIT mode)One McBSP multichannel buffered serial portSix UARTs with IrDA and CIR supportFour SPI serial interfacesThree MMC/SD/SDIO serial interfacesFour I2C master and slave interfaces Parallel Camera Interface (CAM)Up to 128 General-Purpose I/Os (GPIOs)Eight 32-bit general-purpose timers System watchdog timer Dual DDR2, and DDR3 SDRAM interfacesFlexible 8- or 16-bit asynchronous memory interfaceTwo Controller Area Network (DCAN) modulesSpin LockMailboxSerial Hard Disk Drive Interface (SATA 300)

The TMS320DM814x DaVinci video processors also include a high-definition video and imaging coprocessor 2 (HDVICP2), and an SGX530 3D graphics engine to off-load many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. Additionally, it has a complete set of development tools for both the ARM and DSP, which include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Microsoft® Windows® debugger interface for visibility into source code execution.

The C674x DSP core is the high-performance floating-point DSP generation in the TMS320C6000 DSP platform and is code-compatible with previous generation C64x Fixed-Point and C67x Floating-Point DSP generation. The C674x Floating-Point DSP processor uses 32KB of L1 program memory with EDC and 32KB of L1 data memory. Up to 32KB of L1P can be configured as program cache. The remaining memory is noncacheable no-wait-state program memory. Up to 32KB of L1D can be configured as data cache. The remaining memory is noncacheable no-wait-state data memory. The DSP has 256KB of L2 RAM with ECC, which can be defined as SRAM, L2 cache, or a combination of both. All C674x L3 and off-chip memory accesses are routed through an MMU.

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모두 보기15
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* Data sheet TMS320DM814x DaVinci Video Processors datasheet (Rev. E) 2013/12/13
* Errata TMS320DM814x DaVinci Digital Media Processor Errata (Silicon Revs 3.0, 2.1) (Rev. C) 2013/04/15
* User guide TMS320DM8127 and TMS320DM814x DaVinci™ Digital Media Processors TRM (Rev. G) 2016/06/30
Application note High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 2023/02/24
User guide SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 2020/06/01
Application note Error Detection and Correction Mechanism of TMS320C64x+/C674x (Rev. A) 2013/07/19
More literature DM81x Design Network Partners 2012/06/05
Application note TI814x-DDR3-Init-U-Boot 2011/10/31
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06
Product overview DaVinci DM8168 and DM8148 Product Bulletin 2011/03/01
Product overview Software Makes Development Easy for DM8168 and DM8148 2011/03/01
Product overview Video Analytics on TI's Davinci Digital Media Processors Backgrounder 2011/03/01
White paper C6Accel Whitepaper 2010/09/22
User guide TMS320C674x DSP CPU and Instruction Set User's Guide (Rev. B) 2010/07/30
Application note Canny Edge Detection Implementation on TMS320C64x/64x+ Using VLIB 2009/11/25

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Z3 develops and supports open-source software architectures focused on TI's DaVinci and AM57x processors. Products include multimedia centric framework, peripheral drivers, production modules and complete product design services. Z3 also provides system level design and integration for both wired (...)
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디버그 프로브

TMDSEMU200-U — XDS200 USB 디버그 프로브

XDS200은 TI 임베디드 디바이스 디버깅에 사용되는 디버그 프로브(에뮬레이터)입니다. XDS200은 저렴한 XDS110 및 고성능 XDS560v2에 비해 저렴한 비용으로 우수한 성능을 균형 있게 제공합니다. 단일 포드에서 광범위한 표준(IEEE1149.1, IEEE1149.7, SWD)을 지원합니다. 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 (...)

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디버그 프로브

TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다. SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

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디버그 프로브

TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

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소프트웨어 개발 키트(SDK)

LINUXEZSDK-DAVINCI Linux EZ Software Development Kit (EZSDK) for DM814x and DM816x - ALPHA

The Linux EZ Software Development Kit (EZ SDK) allows customers to evaluate their devices in minutes and begin development in less than an hour. This kit provides everything DaVinci™ developers need to evaluate and start developing on the DaVinci™ DM816x/DM814x processors. With the (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
TMS320DM8127 DaVinci 디지털 미디어 프로세서 TMS320DM8147 DaVinci 디지털 미디어 프로세서 TMS320DM8148 DaVinci 디지털 미디어 프로세서
DSP(디지털 신호 프로세서)
TMS320DM8165 DaVinci 디지털 미디어 프로세서 TMS320DM8167 DaVinci 디지털 미디어 프로세서 TMS320DM8168 DaVinci 디지털 미디어 프로세서
다운로드 옵션
드라이버 또는 라이브러리

SPRC264 — TMS320C5000/6000 이미지 라이브러리(IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
드라이버 또는 라이브러리

SPRC265 — TMS320C6000 DSP 라이브러리(DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.

시작 다운로드 옵션
시뮬레이션 모델

DM814x, DM8127 CYE BSDL Model (Rev. A)

SPRM550A.ZIP (16 KB) - BSDL Model
시뮬레이션 모델

DM814x, DM8127 CYE IBIS Model, Revision 2.01 (Rev. A)

SPRM555A.ZIP (3890 KB) - IBIS Model
설계 툴

PROCESSORS-3P-SEARCH — Arm 기반 MPU, arm 기반 MCU 및 DSP 타사 검색 툴

TI는 여러 회사와의 협력을 통해 TI 프로세서를 사용하여 광범위한 소프트웨어, 툴 및 SOM을 제공해서 생산 단계로 가는 속도를 높이고 있습니다. 이 검색 툴을 다운로드하여 타사 솔루션을 빠르게 검색하고 필요에 맞는 올바른 타사를 찾아보세요. 여기에 나열된 소프트웨어, 툴 및 모듈은 텍사스 인스트루먼트가 아닌 독립적인 타사에서 생산 및 관리하고 있습니다.

검색 툴은 다음과 같이 제품 유형별로 분류되어 있습니다.

  • 툴에는 IDE/컴파일러, 디버그 및 추적, 시뮬레이션 및 모델링 소프트웨어, 플래시 프로그래머가 포함되어 있습니다.
  • OS에는 (...)
패키지 다운로드
FCBGA (CYE) 684 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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