홈 로직 및 전압 변환 전압 변환기 및 레벨 시프터 방향 제어 전압 변환기
홈
로직 및 전압 변환
전압 변환기 및 레벨 시프터
방향 제어 전압 변환기
신규

TXV0108

활성

듀얼 공급 방향 제어 8채널 전압 변환기

지금 주문
데이터시트

TXV0108

활성
데이터시트 지금 주문

제품 상세 정보

Technology family AVC Applications GPIO, JTAG, SPI, UART Bits (#) 8 High input voltage (min) (V) 1.08 High input voltage (max) (V) 3.6 Vout (min) (V) 1.65 Vout (max) (V) 3.63 Data rate (max) (Mbps) 0.25 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 16 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State Rating Catalog Operating temperature range (°C) -40 to 125
Technology family AVC Applications GPIO, JTAG, SPI, UART Bits (#) 8 High input voltage (min) (V) 1.08 High input voltage (max) (V) 3.6 Vout (min) (V) 1.65 Vout (max) (V) 3.63 Data rate (max) (Mbps) 0.25 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 16 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State Rating Catalog Operating temperature range (°C) -40 to 125
VQFN (RGY) 24 19.25 mm² 5.5 x 3.5
  • Configurable design allows each port to operate with a power supply range from 1.14V to 3.6V
  • Supports up to 500Mbps for 1.65V to 3.6V
  • Meets RGMII 2.0 timing specifications:
    • < 750ps rise and fall time
    • < ± 5 % duty cycle distortion
    • < ± 400 ps channel to channel skew
    • Up to 250Mbps/Channel

  • Integrated 10 Ω damping output resistor to minimize signal reflections

  • High drive strength (up to 12mA at 3.6V)

  • Fully configurable symmetric dual-rail design
  • Optimal signal integrity performance with 390ps peak-to-peak jitter for 1.8V to 3.3V
  • Features VCC isolation and VCC disconnect
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • 2000V Human-Body Model
    • 1000V Charged-Device Model
  • Low power consumption:
    • 10µA maximum (25°C)
    • 20µA maximum (–40°C to 125°C)
  • Operating temperature from –40°C to +125°C
  • Pin compatible with SN74AVC8T245 (VQFN)
  • Configurable design allows each port to operate with a power supply range from 1.14V to 3.6V
  • Supports up to 500Mbps for 1.65V to 3.6V
  • Meets RGMII 2.0 timing specifications:
    • < 750ps rise and fall time
    • < ± 5 % duty cycle distortion
    • < ± 400 ps channel to channel skew
    • Up to 250Mbps/Channel

  • Integrated 10 Ω damping output resistor to minimize signal reflections

  • High drive strength (up to 12mA at 3.6V)

  • Fully configurable symmetric dual-rail design
  • Optimal signal integrity performance with 390ps peak-to-peak jitter for 1.8V to 3.3V
  • Features VCC isolation and VCC disconnect
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • 2000V Human-Body Model
    • 1000V Charged-Device Model
  • Low power consumption:
    • 10µA maximum (25°C)
    • 20µA maximum (–40°C to 125°C)
  • Operating temperature from –40°C to +125°C
  • Pin compatible with SN74AVC8T245 (VQFN)

The TXV0108 is an 8-bit, dual-supply direction controlled low-skew, low-jitter voltage translation device. This device can be used for redriving, voltage translation, and power isolation when implementing skew sensitive interface, such as RGMII between Ethernet MAC and PHY devices. The Ax I/O pins and control pins (DIR, OE) are referenced to VCCA logic levels, and Bx I/O pins are referenced to VCCB logic levels. This device has improved channel-to-channel skew, duty cycle distortion and symmetric rise and fall time for applications requiring strict timing conditions.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, thus preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature is designed so that if either VCC supply is at or near 0V both ports will switch to a high-impedance state. This feature enables power isolation for communications across multiple MACs and PHYs, and is beneficial in situations where MACs and PHYs are powered up asynchronously preventing current backflow between devices.

A High on DIR allows data transmission from A to B while a Low on DIR allows data transmission from B to A when OE is set to Low. When OE is set to High, both Ax and Bx pins will be forced into a high-impedance state. See Device Functional Modes for a summary of the operation of the control logic.

The TXV0108 is an 8-bit, dual-supply direction controlled low-skew, low-jitter voltage translation device. This device can be used for redriving, voltage translation, and power isolation when implementing skew sensitive interface, such as RGMII between Ethernet MAC and PHY devices. The Ax I/O pins and control pins (DIR, OE) are referenced to VCCA logic levels, and Bx I/O pins are referenced to VCCB logic levels. This device has improved channel-to-channel skew, duty cycle distortion and symmetric rise and fall time for applications requiring strict timing conditions.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, thus preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature is designed so that if either VCC supply is at or near 0V both ports will switch to a high-impedance state. This feature enables power isolation for communications across multiple MACs and PHYs, and is beneficial in situations where MACs and PHYs are powered up asynchronously preventing current backflow between devices.

A High on DIR allows data transmission from A to B while a Low on DIR allows data transmission from B to A when OE is set to Low. When OE is set to High, both Ax and Bx pins will be forced into a high-impedance state. See Device Functional Modes for a summary of the operation of the control logic.
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기술 문서

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모두 보기5
유형 직함 날짜
* Data sheet TXV0108 8-Bit Direction Controlled Low-Skew, Low-Jitter Voltage Translator or Buffer datasheet (Rev. A) PDF | HTML 2024/04/12
EVM User's guide TXV010xEVM Evaluation Module User's Guide PDF | HTML 2024/02/05
Application note Overcoming Design Challenges - Implementing High Performance Interfaces PDF | HTML 2023/12/12
Application brief Supporting Time and Skew Sensitive Interfaces with TI's TXV Level-Shifter PDF | HTML 2023/10/27
Application brief Enabling Industrial and Automotive Ethernet RGMII Interfaces with Voltage Transl PDF | HTML 2023/08/02

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

14-24-NL-LOGIC-EVM — 14핀~24핀 비 리드 패키지용 로직 제품 일반 평가 모듈

14-24-NL-LOGIC-EVM은 14핀~24핀 BQA, BQB, RGY, RSV, RJW 또는 RHL 패키지가 있는 로직 또는 변환 디바이스를 지원하도록 설계된 유연한 평가 모듈(EVM)입니다.

사용 설명서: PDF | HTML
TI.com에서 구매할 수 없습니다
평가 보드

TXV0108-EVM — TXV0108 평가 모듈

TXV0108 평가 모듈(EVM)은 TXV0108 장치의 기능 및 성능 평가를 위한 플랫폼으로 사용이 간편합니다. EVM에는 여러 애플리케이션을 위해 장치를 구성할 수 있는 선택적 회로와 점퍼가 있습니다. 이 장치는 고정 및 방향 제어 낮은 스큐, 저지터 전압 변환에 대한 옵션을 제공합니다. 출력은 전용 출력 활성화(OE) 제어 기능을 통해 활성화 및 비활성화할 수 있습니다.
사용 설명서: PDF | HTML
TI.com에서 구매할 수 없습니다
시뮬레이션 모델

TXV0108 IBIS Model

SCEM798.ZIP (44 KB) - IBIS Model
다운로드
패키지 핀 다운로드
VQFN (RGY) 24 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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포럼 주제 모두 보기(영문)

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