CSD95379Q3M

現行

同步降壓 NexFET 功率級,CSD95379Q3M

產品詳細資料

VDS (V) 20 Ploss current (A) 12
VDS (V) 20 Ploss current (A) 12
VSON-CLIP (DNS) 10 10.89 mm² 3.3 x 3.3
  • 92.5% System Efficiency at 12 A
  • Ultra-Low Power Loss of 1.8 W at 12 A
  • Max Rated Continuous Current of 20 A and Peak Current of 45 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.3-mm × 3.3-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Low Quiescent (LQ) and Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 92.5% System Efficiency at 12 A
  • Ultra-Low Power Loss of 1.8 W at 12 A
  • Max Rated Continuous Current of 20 A and Peak Current of 45 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.3-mm × 3.3-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Low Quiescent (LQ) and Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95379Q3M NexFET™ power stage is a highly optimized design for use in high-power, high-density synchronous buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces high-current, high-efficiency, and high-speed switching capability in a small 3.3-mm × 3.3-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95379Q3M NexFET™ power stage is a highly optimized design for use in high-power, high-density synchronous buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces high-current, high-efficiency, and high-speed switching capability in a small 3.3-mm × 3.3-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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技術文件

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類型 標題 日期
* Data sheet CSD95379Q3M Synchronous Buck NexFET Power Stage datasheet (Rev. D) PDF | HTML 2016年 12月 30日
Technical article How to create a power supply for Intel’s Braswell processor PDF | HTML 2015年 8月 10日

設計與開發

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模擬型號

CSD95379Q3M PSpice Transient Model

SLPM112.ZIP (17 KB) - PSpice Model
模擬型號

CSD95379Q3M TINA-TI Reference Design

SLPM311.TSC (2606 KB) - TINA-TI Reference Design
模擬型號

CSD95379Q3M TINA-TI Spice Model

SLPM310.ZIP (43 KB) - TINA-TI Spice Model
參考設計

PMP22510 — 切換式電容器整合式降壓 (SCIB) 電源轉換器參考設計

This switched capacitor integrated buck (SCIB) converter is a highly-optimized design for use in a high-power, high-density single output power converter, operating from a wide-range 40-V to 60-V input rail to produce a 8.0-V, 5.0-V, 3.3-V or 1.8-V rail up to 40A of load current each phase. This (...)
Test report: PDF
電路圖: PDF
封裝 引腳 下載
VSON-CLIP (DNS) 10 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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