TLV274
- Rail-to-Rail Output
- Wide Bandwidth: 3 MHz
- High Slew Rate: 2.4 V/µs
- Supply Voltage Range: 2.7 V to 16 V
- Supply Current: 550 µA/Channel
- Input Noise Voltage: 39 nV/√Hz
- Input Bias Current: 1 pA
- Specified Temperature Range:
- Commercial Grade: 0°C to 70°C
- Industrial Grade: –40°C to 125°C
- Ultrasmall Packaging:
- 5-Pin SOT-23 (TLV271)
- 8-Pin MSOP (TLV272)
- Ideal Upgrade for TLC72x Family
Operating from 2.7 V to 16 V over the extended industrial temperature range from –40°C to +125°C, the TLV27x is a low power, wide bandwidth operational amplifier (opamp) with rail to rail output. This makes it an ideal alternative to the TLC27x family for applications where rail-to-rail output swings are essential. The TLV27x provides 3-MHz bandwidth from only 550 µA.
Like the TLC27x, the TLV27x is fully specified for 5-V and ±5-V supplies. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from a variety of rechargeable cells (±8 V supplies down to ±1.35 V).
The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an attractive alternative for the TLC27x in battery-powered applications.
All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package.
The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of many micropower microcontrollers available today including TIs MSP430.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV27x Family of 550-µA/Ch, 3-MHz, Rail-to-Rail Output Operational Amplifiers datasheet (Rev. E) | PDF | HTML | 2016年 11月 30日 |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | TLV271, TLV272, TLV274 EMI Immunity Performance | 2012年 12月 19日 |
設計與開發
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封裝 | 引腳 | 下載 |
---|---|---|
PDIP (N) | 14 | 檢視選項 |
SOIC (D) | 14 | 檢視選項 |
TSSOP (PW) | 14 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點