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運算放大器 (op amps)
功率運算放大器

TLV4113-EP

現行

具備關機功能的強化型產品雙路高輸出驅動運算放大器

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產品規格表

TLV4113-EP

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.5 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Iout (typ) (A) 0.32 GBW (typ) (MHz) 2.7 Slew rate (typ) (V/µs) 1.57 Vos (offset voltage at 25°C) (max) (mV) 3.5 Offset drift (typ) (V/°C) 0.000003 Iq per channel (typ) (mA) 0.7 Features Shutdown Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125 Input bias current (max) (pA) 25 CMRR (typ) (dB) 68 Rail-to-rail In to V-, Out Architecture CMOS
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.5 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Iout (typ) (A) 0.32 GBW (typ) (MHz) 2.7 Slew rate (typ) (V/µs) 1.57 Vos (offset voltage at 25°C) (max) (mV) 3.5 Offset drift (typ) (V/°C) 0.000003 Iq per channel (typ) (mA) 0.7 Features Shutdown Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125 Input bias current (max) (pA) 25 CMRR (typ) (dB) 68 Rail-to-rail In to V-, Out Architecture CMOS
HVSSOP (DGQ) 10 14.7 mm² 3 x 4.9
  • Controlled Baseline
    • One Assembly Site
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High Output Drive . . . >300 mA
  • Rail-To-Rail Output
  • Unity-Gain Bandwidth . . . 2.7 MHz
  • Slew Rate . . . 1.5 V/µs
  • Supply Current . . . 700 µA/Per Channel
  • Supply Voltage Range . . . 2.5 V to 6 V
  • Universal Op Amp EVM

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

PowerPAD is a trademark of Texas Instruments.
3Parts, Microsim PSpice are trademarks of MicroSim Corporation.
  • Controlled Baseline
    • One Assembly Site
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High Output Drive . . . >300 mA
  • Rail-To-Rail Output
  • Unity-Gain Bandwidth . . . 2.7 MHz
  • Slew Rate . . . 1.5 V/µs
  • Supply Current . . . 700 µA/Per Channel
  • Supply Voltage Range . . . 2.5 V to 6 V
  • Universal Op Amp EVM

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

PowerPAD is a trademark of Texas Instruments.
3Parts, Microsim PSpice are trademarks of MicroSim Corporation.

The TLV411x single supply operational amplifiers provide output currents in excess of 300 mA at 5 V. This enables standard pin-out amplifiers to be used as high current buffers or in coil driver applications. The TLV4110 and TLV4113 come with a shutdown feature.

The TLV411x is available in the ultra-small MSOP PowerPAD package, which offers the exceptional thermal impedance required for amplifiers delivering high current levels.

All TLV411x devices are offered in SOIC (single and dual) and MSOP PowerPAD (dual).

The TLV411x single supply operational amplifiers provide output currents in excess of 300 mA at 5 V. This enables standard pin-out amplifiers to be used as high current buffers or in coil driver applications. The TLV4110 and TLV4113 come with a shutdown feature.

The TLV411x is available in the ultra-small MSOP PowerPAD package, which offers the exceptional thermal impedance required for amplifiers delivering high current levels.

All TLV411x devices are offered in SOIC (single and dual) and MSOP PowerPAD (dual).
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技術文件

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類型 標題 日期
* Data sheet High-Output-Drive Operational Amplifier With Shutdown datasheet (Rev. D) 2008年 5月 6日
* VID TLV4113-EP VID V6206646 2016年 6月 21日
E-book The Signal e-book: A compendium of blog posts on op amp design topics 2017年 3月 28日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

模擬型號

TLV411x PSpice Model (Rev. B)

SLOM466B.ZIP (31 KB) - PSpice Model
下載
模擬型號

TLV411x TINA-TI Reference Design (Rev. B)

SLOM465B.TSC (317 KB) - TINA-TI Reference Design
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模擬型號

TLV411x TINA-TI Spice Model (Rev. B)

SLOM464B.ZIP (10 KB) - TINA-TI Spice Model
下載
計算工具

ANALOG-ENGINEER-CALC — 類比工程師計算機

The Analog Engineer’s Calculator is designed to speed up many of the repetitive calculations that analog circuit design engineers use on a regular basis. This PC-based tool provides a graphical interface with a list of various common calculations ranging from setting op-amp gain with feedback (...)
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模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
要求
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
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訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

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