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TLVM13630

現行

高密度、3-V 至 36-V 輸入、1-V 至 6-V 輸出、3-A 降壓電源模組

產品詳細資料

Iout (max) (A) 3 Vin (max) (V) 36 Vin (min) (V) 3 Vout (max) (V) 6 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Features EMI Tested, Enable, Overcurrent protection, Power good Control mode current mode Switching frequency (max) (Hz) 2200000 Switching frequency (min) (Hz) 200000
Iout (max) (A) 3 Vin (max) (V) 36 Vin (min) (V) 3 Vout (max) (V) 6 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Features EMI Tested, Enable, Overcurrent protection, Power good Control mode current mode Switching frequency (max) (Hz) 2200000 Switching frequency (min) (Hz) 200000
B0QFN (RDH) 30 24 mm² 6 x 4
  • Versatile synchronous buck DC/DC module
    • Integrated MOSFETs, inductor, and controller
    • Wide input voltage range of 3 V to 36 V
    • Adjustable output voltage from 1 V to 6 V with 1% setpoint accuracy over temperature
    • 4-mm × 6-mm × 1.8-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • 93% peak efficiency at 12 VIN, 5 VOUT,1 MHz
    • External bias option for improved efficiency
    • Shutdown quiescent current of 0.6 µA (typical)
    • 0.4-V typical dropout voltage at 3-A load
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Constant-frequency FPWM mode of operation
    • Meets CISPR 11 and 32 class B emissions
  • Suitable for scalable power supplies
    • Pin compatible with the TLVM13620 (36 V, 2 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Hiccup-mode overcurrent protection
    • Thermal shutdown protection with hysteresis
  • Create a custom design using the TLVM13630 with the WEBENCH Power Designer
  • Versatile synchronous buck DC/DC module
    • Integrated MOSFETs, inductor, and controller
    • Wide input voltage range of 3 V to 36 V
    • Adjustable output voltage from 1 V to 6 V with 1% setpoint accuracy over temperature
    • 4-mm × 6-mm × 1.8-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • 93% peak efficiency at 12 VIN, 5 VOUT,1 MHz
    • External bias option for improved efficiency
    • Shutdown quiescent current of 0.6 µA (typical)
    • 0.4-V typical dropout voltage at 3-A load
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Constant-frequency FPWM mode of operation
    • Meets CISPR 11 and 32 class B emissions
  • Suitable for scalable power supplies
    • Pin compatible with the TLVM13620 (36 V, 2 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Hiccup-mode overcurrent protection
    • Thermal shutdown protection with hysteresis
  • Create a custom design using the TLVM13630 with the WEBENCH Power Designer

The TLVM13630 synchronous buck power module is a highly integrated 36-V, 3-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has pins for VIN and VOUT located at the corners of the package for optimized input and output capacitor layout placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage range from 1 V to 6 V, the TLVM13630 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TLVM13630 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, integrated VCC, bootstrap and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range for enhanced load transient performance, negative output voltage capability for inverting applications, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

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The TLVM13630 synchronous buck power module is a highly integrated 36-V, 3-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has pins for VIN and VOUT located at the corners of the package for optimized input and output capacitor layout placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage range from 1 V to 6 V, the TLVM13630 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TLVM13630 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, integrated VCC, bootstrap and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range for enhanced load transient performance, negative output voltage capability for inverting applications, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

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類型 標題 日期
* Data sheet TLVM13630 High-Density, 3-V to 36-V Input, 1-V to 6-V Output, 3-A Power Module With Enhanced HotRod™ QFN Package datasheet (Rev. B) PDF | HTML 2022年 1月 10日
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 2024年 3月 14日
White paper Addressing Factory Automation Challenges with Innovations in Power Design 2021年 9月 28日
EVM User's guide Using the TLVM13630EVM PDF | HTML 2021年 5月 4日
Certificate TLVM13630EVM EU Declaration of Conformity (DoC) 2021年 4月 19日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TLVM13630EVM — TLVM13630 評估板 3-V 至 36-V 輸入、1-V 至 6-V、3-A 輸出電源模組

可設定 TLVM13630 評估板 (EVM) 以評估 TLVM13630 電源模組的運作。輸入電壓範圍為 3 V 至 36 V。輸出電壓範圍為 1 V 至 6 V。使用此評估板可輕鬆評估 TLVM13630 的運作。
使用指南: PDF | HTML
TI.com 無法提供
模擬型號

TLVM13630 PSpice Transient Model

SLVMDP1.ZIP (440 KB) - PSpice Model
計算工具

SLVRBK8 TLVM136x0 Power Module Quickstart Design Tool

Welcome to the TLVM13620, TLVM13630, TLVM13640 and TLVM13660 power module quickstart calculator design tool. This standalone tool facilitates and assists the power supply engineer with the design of a DC/DC buck regulator based on this family of synchronous buck power modules. As such, the user can (...)

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產品
Power modules (integrated inductor)
TLVM13620 採用 4-mm x 6-mm x 1.8-mm 封裝的 3.6-V 至 36-V 輸入、1-V 至 6-V 輸出、2-A 降壓模組 TLVM13630 高密度、3-V 至 36-V 輸入、1-V 至 6-V 輸出、3-A 降壓電源模組 TLVM13660 採用 5 公釐 x 5.5 公釐增強型 HotRod™ QFN 的 36-V 輸入、1-V 至 6-V 輸出、6- A 降壓電源模組
硬體開發
開發板
TLVM13660EVM TLVM13660 評估板 3-V 至 36-V 輸入、1-V 至 6-V、6-A 輸出電源模組 TLVM13630EVM TLVM13630 評估板 3-V 至 36-V 輸入、1-V 至 6-V、3-A 輸出電源模組
計算工具

TLVM136X0DESIGN-CALC — TLVM136X0 系列電源模組快速啓動計算機設計工具

歡迎使用 TLVM13620、TLVM13630、TLVM13640 和 TLVM13660 電源模組快速啓動計算器設計工具。此獨立工具會加速協助提供電源供應器工程師採用此同步降壓電源模組系列的 DC/DC 降壓穩壓器進行設計。因此,使用者可以迅速達到最佳化的設計,以符合應用需求。
使用指南: PDF | HTML
使用指南: PDF | HTML
參考設計

TIDA-010261 — 具有數據線供電能力的 10BASE-T1L 單對乙太網路感測器參考設計

此參考設計說明包含數據線供電能力 (PoDL) 的單對乙太網路 (SPE) 通訊後端實作。此設計使用 Sitara™ AM2434 MCU,在一側介接類比前端,並於另一側介接乙太網路實體 (PHY) 層。強大的 MCU 不僅可以將感測器資料轉送至乙太網路,還可以在邊緣進行資料處理。
Design guide: PDF
封裝 引腳 下載
B0QFN (RDH) 30 檢視選項

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  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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