首頁 感測器 溫度感測器 數位溫度感測器
首頁
感測器
溫度感測器
數位溫度感測器

TMP006

不推薦在新設計中採用

採用 WCSP 封裝的紅外線熱電堆非接觸式溫度感測器

立即訂購
產品規格表

TMP006

不推薦在新設計中採用
產品規格表 立即訂購

產品詳細資料

Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) to Supply voltage (min) (V) 2.2 Interface type I2C, SMBus Supply voltage (max) (V) 5.5V Temp resolution (max) (Bits) 14 Rating Catalog
Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) to Supply voltage (min) (V) 2.2 Interface type I2C, SMBus Supply voltage (max) (V) 5.5V Temp resolution (max) (Bits) 14 Rating Catalog
DSBGA (YZF) 8 3.0625 mm² 1.75 x 1.75
  • Integrated MEMs Thermopile for Noncontact Temperature Sensing
  • Local Temperature Sensor for Cold Junction Reference
    • ±1°C (max) from 0°C to 60°C
    • ±1.5°C (max) from –40°C to +125°C
  • Two-Wire Serial Interface Options:
    • I2C and SMBus Compatible
      • TMP006 at 3.3 V
      • TMP006B at 1.8 V
    • Eight Programmable Addresses
  • Low Power
    • Supply: 2.2 V to 5.5 V
    • Active Current: 240 µA (typ)
    • 1-µA shutdown (max)
  • Compact Package
    • 1.6-mm × 1.6-mm × 0.625-mm DSBGA
  • Integrated MEMs Thermopile for Noncontact Temperature Sensing
  • Local Temperature Sensor for Cold Junction Reference
    • ±1°C (max) from 0°C to 60°C
    • ±1.5°C (max) from –40°C to +125°C
  • Two-Wire Serial Interface Options:
    • I2C and SMBus Compatible
      • TMP006 at 3.3 V
      • TMP006B at 1.8 V
    • Eight Programmable Addresses
  • Low Power
    • Supply: 2.2 V to 5.5 V
    • Active Current: 240 µA (typ)
    • 1-µA shutdown (max)
  • Compact Package
    • 1.6-mm × 1.6-mm × 0.625-mm DSBGA

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor.

The TMP007 is an enhanced version of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an additional math engine to perform all of the equations on chip, allowing the target object temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile memory for storing calibration coefficients.

The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure an object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).

 

 

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor.

The TMP007 is an enhanced version of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an additional math engine to perform all of the equations on chip, allowing the target object temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile memory for storing calibration coefficients.

The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure an object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).

 

 
open-in-new 尋找其它 數位溫度感測器
下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 2
類型 標題 日期
* Data sheet TMP006/B Infrared Thermopile Sensor in Chip-Scale Package datasheet (Rev. E) PDF | HTML 2015年 4月 9日
Technical article Taking advantage of real-time operating systems with MSP432 MCUs PDF | HTML 2015年 5月 27日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

子卡

BOOSTXL-EDUMKII — 教育 BoosterPack MKII

Download Design Files

The Educational BoosterPack MKII offers a high level of integration for developers to quickly prototype complete solutions. Various analog and digital inputs/outputs are at your disposal including an analog joystick, environmental and motion sensors, RGB LED, microphone, (...)

使用指南: PDF | HTML
TI.com 無法提供
外掛程式

SIMPLELINK-SDK-SENSOR-ACTUATOR-PLUGIN — Sensor and Actuator Plug-in for SimpleLink™ MCU SDKs

The Sensor and Actuator Plugin for SimpleLink™ MCU SDKs provides support for a variety of related components including optical and temperature and humidity sensors, allowing customers to easily add new features to their SimpleLink MCU-based design. API user guides are provided for each (...)

lock = 需要匯出核准 (1 分鐘)
支援產品和硬體

支援產品和硬體

產品
數位溫度感測器
TMP006 — 採用 WCSP 封裝的紅外線熱電堆非接觸式溫度感測器 TMP007 — 採用 WCSP 封裝、具整合式數學引擎的紅外線熱電堆非接觸式溫度感應器 TMP116 — 具有 64 位元非揮發性記憶體的 0.2C 數位溫度感測器
超音波感測器 AFE
PGA460 — 超音波訊號處理器與收發驅動器
Wi-Fi 產品
CC3220MODA — 具有天線的 SimpleLink™ 32 位元 Arm Cortex-M4 Wi-Fi CERTIFIED™ 無線模組 CC3220R — 具 6 TLS/SSL 和 256kB RAM 的 SimpleLink™ 32 位元 Arm Cortex-M4 Wi-Fi® 無線 MCU CC3220S — 具安全開機和 256kB RAM 的 SimpleLink™ 32 位元 Arm Cortex-M4 Wi-Fi® 無線 MCU CC3220SF — 具 1MB 快閃記憶體和 256kB RAM 的 SimpleLink™ 32 位元 Arm Cortex-M4 Wi-Fi® 無線 MCU
線性霍爾效應感測器
DRV5055 — 具有類比輸出的比率線性霍爾效應感測器
濕度感測器
HDC2010 — 2% RH 超小型、低功耗數位相對濕度感測器 HDC2080 — 2% RH 超低功耗數位相對濕度感測器、中斷/DRDY
精確 ADC
ADS7142 — 採用 1.5-mm x 2-mm QFN 封裝，具 1.8V 操作電壓的 12 位元 140 kSPS 2 通道奈米功率 SAR ADC ADS7142-Q1 — 具有可編程閾值和主機喚醒功能的車用雙通道 12 位元 140 kSPS I2C 相容 ADC
低耗電 2.4-GHz 產品
CC2640R2F — 具 128-kB 快閃記憶體的 SimpleLink™ 32 位元 Arm® Cortex®-M3 Bluetooth® 5.1 低耗能無線 MCU
周圍光源感測器
OPT3001 — 具高精密人眼反應功能的數位環境光感測器 (ALS)
硬體開發
BOOSTXL-ADS7142-Q1 — ADS7142-Q1 2 通道 12 位元 140-kSPS I2C 相容 ADC BoosterPack™ 外掛程式模組 BOOSTXL-BASSENSORS — 適用於建築自動化的感測器 BoosterPack 插入式模組 BOOSTXL-PGA460 — 具有轉換器的 PGA460-Q1 超音波感測器訊號調節評估模組 BOOSTXL-ULN2003 — 配備 ULN2003 和 CSD17571Q2 NexFET™ 的雙步進馬達驅動器 BoosterPack CC3220S-LAUNCHXL — CC3220S LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU CC3220SF-LAUNCHXL — CC3220SF LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU LAUNCHXL-CC1310 — CC1310 LaunchPad™ development kit for sub-1-GHz SimpleLink™ wireless MCU LAUNCHXL-CC1352R1 — CC1352R LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LAUNCHXL-CC2640R2 — CC2640R2 LaunchPad™ development kit for SimpleLink™ Bluetooth® Low Energy wireless MCU LAUNCHXL-CC26X2R1 — 多標準 SimpleLink™ 無線 MCU 的 CC26x2R LaunchPad™ 開發套件 MSP-EXP432E401Y — MSP432E401Y LaunchPad™ development kit for Ethernet SimpleLink™ MCU
瀏覽 下載選項
支援軟體

SBOC407 — TMP006EVM Software Source Code

支援產品和硬體

支援產品和硬體

產品
數位溫度感測器
TMP006 — 採用 WCSP 封裝的紅外線熱電堆非接觸式溫度感測器
下載
支援軟體

SBOC408 — TMP006EVM User Software

支援產品和硬體

支援產品和硬體

產品
數位溫度感測器
TMP006 — 採用 WCSP 封裝的紅外線熱電堆非接觸式溫度感測器
下載
支援軟體

SENSORTAG-SW — SimpleLink™ SensorTag 軟體

The SensorTag includes an open hardware and software reference design for low cost and low power wireless IoT applications. The SensorTag is supplied with complete source code with everything you need to customize it for your application as well as source code examples for mobile apps.
使用指南: PDF
檢視選項
參考設計

TIDA-00554 — 具有 Bluetooth 連線且適用於可攜式化學分析的 DLP 超行動 NIR 光譜儀

The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDC-CC3200MODLAUNCHXL — SimpleLink™ Wi-Fi® CC3200 模組 LaunchPad

CC3200MODLAUNCHXL 是裝載 CC3200MOD 的低成本評估平台。SimpleLink™ CC3200MOD 無線微控制器 (MCU) 模組整合以 ARM® Cortex™-M4 為基礎的 MCU，允許客戶使用單一裝置開發整套應用程式。模組 LaunchPad 也具備可編程的使用者按鈕、適用於自訂應用程式的 RGB LED、溫度及加速計感測器，以及可偵錯的板載模擬。LaunchPad 可堆疊接頭介面展示在與現有 BoosterPack 附加電路板上的其他周邊設備介接時，如何擴充 CC3200MOD 的功能性，例如圖形顯示、音訊轉碼器、天線選擇、環境感測及其他更多項目。
使用指南: PDF
電路圖: PDF
參考設計

TIDM-SMBUS — 使用低功耗微控制器的 SMBus 設計

This design utilizes existing Launchpad evaluation kits and BoosterPack plug-in modules to demonstrate the implementation of a SMBus-based system using Texas Instrument’s MSP430 SMBus Library.
Design guide: PDF
電路圖: PDF
參考設計

CC2541-SENSORTAG-IBEACON-RD — 搭載 iBeacon™ 技術的 SensorTag

The SimpleLink Bluetooth® Smart SensorTag removes the barriers to entry for smartphone app developers who want to take advantage of the growing number of Bluetooth® Smart-enabled smartphones and tablets. iBeacon Technology is a very low cost method for providing mobile phones with (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDM-LPBP-SENSORHUB — 具有七個板載感測器的全方位感測器集線器解決方案

This Sensor Hub design uses a Tiva platform for evaluating the use of ARM® Cortex™-M4-based TM4C devices in sensor fusion applications, demonstrating the mathematical and algorithm computation features of the M4 architecture. This design features seven on-board sensor functions including (...)
電路圖: PDF
封裝 引腳 下載
DSBGA (YZF) 8 檢視選項
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片