TMS37145
- Low-frequency (LF) immobilizer interface
- 75-byte EEPROM
- 80-bit DST80 security authentication coprocessor
- Integrated batteryless immobilizer interface
- Half duplex (HDX) immobilizer communication achieves up to 4-in (10-cm) read range
- Special selective addressing mode allows reliable learn-in sequence
- 80-bit authentication key length
- Up to 8-kbit/s uplink data rate
- 5- or 3-byte challenge/response algorithm
- Fast authentication within 42 ms
- Fast mutual authentication within 65 ms
- 75-byte EEPROM
- 48-bytes of available EEPROM user memory
- 32-bit unique serial number
- High EEPROM security and flexibility
- Write-only authentication keys
- Pages are irreversibly lockable and protectable
- Protected pages programmable only through mutual authentication
- Each user page is lockable
- Resonant frequency: 134.2 kHz
This security RFID transponder provides an 80-bit encryption algorithm. The 5-byte challenge and 3-byte response algorithm is backward compatible with existing TI products and provides, together with the burst length coding, short encryption telegram times.
The DST80 offers 65 bytes of free programmable user data stored in nine pages, each of them lockable for programming. Each of the two 80-bit encryption keys with can be programmed with a single telegram.
The DST80 comes in two versions, preprogrammed with either PWM or PPM communication formats, eliminating the need for the user to change this field.
For a higher security level, the DSTAES transponder with AES-128 encryption is recommended.
更多資訊
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技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | Digital Signature Transponder With Integrated DST80 Authentication, EEPROM, and LF Immobilizer datasheet (Rev. A) | PDF | HTML | 2020年 1月 29日 |
| Application note | Resonant Trimming Sequence | 2013年 1月 9日 | ||
| Application note | TMS3705 Range Extender Power Solution Using UCC27424-Q1 | 2012年 8月 9日 |
設計與開發
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| 封裝 | 引腳 | 下載 |
|---|---|---|
| RFIDP (TEA) | — |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點