TPA122
- 150-mW Stereo Output
- PC Power Supply Compatible
- Fully Specified for 3.3-V and 5-V Operation
- Operation to 2.5 V
- Pop Reduction Circuitry
- Internal Midrail Generation
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- PowerPAD™ MSOP
- SOIC
- Pin Compatible With LM4880 and LM4881 (SOIC)
PowerPAD is a trademark of Texas Instruments.
The TPA122 is a stereo audio power amplifier packaged in either an 8-pin SOIC, or an 8-pin PowerPAD MSOP package capable of delivering 150 mW of continuous RMS power per channel into 8- loads. Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 1 to 10.
THD+N when driving an 8- loads, the THD+N performance is 0.01% at 1 kHz, and less than 0.02% across the audio band of 20 Hz to 20 kHz.
技術文件
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檢視所有 4 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPA122: 150-mW Stereo Audio Power Amplifier datasheet (Rev. E) | 2004年 6月 29日 | |
Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018年 7月 6日 | ||
Application note | A Low-Cost, Single Coupling Capacitor Config. for Stereo Headphone Amplifiers | 1999年 12月 22日 | ||
User guide | TPA122MSOPEVM - User Guide | 1998年 8月 24日 |
設計與開發
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模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
封裝 | 引腳 | 下載 |
---|---|---|
HVSSOP (DGN) | 8 | 檢視選項 |
SOIC (D) | 8 | 檢視選項 |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點