首頁 電源管理 電源開關 負載開關

TPS22925

現行

具輸出放電的 3.6-V、3-A、9.2-mΩ 負載開關

產品詳細資料

Number of channels 1 Vin (min) (V) 0.65 Vin (max) (V) 3.6 Imax (A) 3 Ron (typ) (mΩ) 10.3 Shutdown current (ISD) (typ) (µA) 0.5 Quiescent current (Iq) (typ) (µA) 60 Soft start Fixed Rise Time Current limit type None Features Quick output discharge, Reverse current protection Rating Catalog Operating temperature range (°C) -40 to 105 FET Internal Device type Load switches Function Inrush current control, Reverse current blocking
Number of channels 1 Vin (min) (V) 0.65 Vin (max) (V) 3.6 Imax (A) 3 Ron (typ) (mΩ) 10.3 Shutdown current (ISD) (typ) (µA) 0.5 Quiescent current (Iq) (typ) (µA) 60 Soft start Fixed Rise Time Current limit type None Features Quick output discharge, Reverse current protection Rating Catalog Operating temperature range (°C) -40 to 105 FET Internal Device type Load switches Function Inrush current control, Reverse current blocking
DSBGA (YPH) 6 2.1875 mm² 1.25 x 1.75
  • Input Voltage Range: 0.65 V to 3.6 V
  • On-Resistance
    • RON = 9.2 mΩ at VIN = 3.6 V
    • RON = 9.2 mΩ at VIN = 1.8 V
    • RON = 10.2 mΩ at VIN = 1 V
    • RON = 13.1 mΩ at VIN = 0.65 V
  • 3-A Maximum Continuous Switch Current
  • Quiescent Current, IQ,VIN = 29 µA at VIN = 3.6 V
  • Low Control Input Threshold Enables 1.5-, 1.8-, 2.5-, or 3.3-V Logic
  • Controlled Slew Rate
    • tR = 97 µs at VIN = 3.6 V (TPS22925Bx)
    • tR = 810 µs at VIN = 3.6 V (TPS22925Cx)
  • Reverse Current Blocking (When Disabled)
  • Quick Output Discharge (QOD) (TPS22925B and TPS22925C only)
  • Wafer Chip Scale Package:
    • 0.9 mm × 1.4 mm, 0.5-mm Pitch, 0.4-mm Height
  • ESD Performance Tested per JESD 22
    • 2-kV HBM and 1-kV CDM
  • Input Voltage Range: 0.65 V to 3.6 V
  • On-Resistance
    • RON = 9.2 mΩ at VIN = 3.6 V
    • RON = 9.2 mΩ at VIN = 1.8 V
    • RON = 10.2 mΩ at VIN = 1 V
    • RON = 13.1 mΩ at VIN = 0.65 V
  • 3-A Maximum Continuous Switch Current
  • Quiescent Current, IQ,VIN = 29 µA at VIN = 3.6 V
  • Low Control Input Threshold Enables 1.5-, 1.8-, 2.5-, or 3.3-V Logic
  • Controlled Slew Rate
    • tR = 97 µs at VIN = 3.6 V (TPS22925Bx)
    • tR = 810 µs at VIN = 3.6 V (TPS22925Cx)
  • Reverse Current Blocking (When Disabled)
  • Quick Output Discharge (QOD) (TPS22925B and TPS22925C only)
  • Wafer Chip Scale Package:
    • 0.9 mm × 1.4 mm, 0.5-mm Pitch, 0.4-mm Height
  • ESD Performance Tested per JESD 22
    • 2-kV HBM and 1-kV CDM

The TPS22925 product family consists of four devices: TPS22925B, TPS22925BN, TPS22925C, and TPS22925CN. Each device is a 9-mΩ, single-channel load switch with a controlled slew rate.

The devices contain an N–channel MOSFET that can operate over an input voltage range of 0.65 V to 3.6 V and can support a maximum continuous current of 3 A. This continuous current enables the devices to be used across multiple designs and end equipments. Each of the TPS22925 devices provides reverse current blocking when disabled allowing for power supply protection and power multiplexing capabilities.

The controlled rise time for the device greatly reduces inrush current caused by large bulk load capacitances, thereby reducing or eliminating power supply droop. When operating with an input voltage of 3.6 V, the TPS22925Bx devices feature a 97 µs rise time and the TPS22925Cx devices feature an 810 µs rise time.

The TPS22925 family of devices can help reduce the total solution size by offering an optional integrated, 150-Ω pull–down resistor for quick output discharge (QOD) when the switch is turned off. Each of the TPS22925 devices is available in a 0.9 mm × 1.4 mm, 0.5-mm pitch, 0.4-mm height 6–pin wafer chip scale package (WCSP) allowing for smaller, more integrated designs. The WCSP and 9 mΩ of on-resistance allow use in space constrained, battery powered applications. The device is characterized for operation over the free–air temperature range of –40°C to +105°C.

The TPS22925 product family consists of four devices: TPS22925B, TPS22925BN, TPS22925C, and TPS22925CN. Each device is a 9-mΩ, single-channel load switch with a controlled slew rate.

The devices contain an N–channel MOSFET that can operate over an input voltage range of 0.65 V to 3.6 V and can support a maximum continuous current of 3 A. This continuous current enables the devices to be used across multiple designs and end equipments. Each of the TPS22925 devices provides reverse current blocking when disabled allowing for power supply protection and power multiplexing capabilities.

The controlled rise time for the device greatly reduces inrush current caused by large bulk load capacitances, thereby reducing or eliminating power supply droop. When operating with an input voltage of 3.6 V, the TPS22925Bx devices feature a 97 µs rise time and the TPS22925Cx devices feature an 810 µs rise time.

The TPS22925 family of devices can help reduce the total solution size by offering an optional integrated, 150-Ω pull–down resistor for quick output discharge (QOD) when the switch is turned off. Each of the TPS22925 devices is available in a 0.9 mm × 1.4 mm, 0.5-mm pitch, 0.4-mm height 6–pin wafer chip scale package (WCSP) allowing for smaller, more integrated designs. The WCSP and 9 mΩ of on-resistance allow use in space constrained, battery powered applications. The device is characterized for operation over the free–air temperature range of –40°C to +105°C.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 10
類型 標題 日期
* Data sheet TPS22925 3.6-V, 3-A, 9-mΩ On-Resistance Load Switch datasheet (Rev. D) PDF | HTML 2016年 8月 15日
Application note Load Switch Thermal Considerations (Rev. A) 2018年 10月 11日
Application note Basics of Load Switches (Rev. A) 2018年 9月 5日
Application note Power Multiplexing Using Load Switches and eFuses (Rev. A) 2017年 6月 20日
Application note Selecting a Load Switch to Replace a Discrete Solution 2017年 4月 30日
Application note Timing of Load Switches 2017年 4月 27日
Application note Reverse Current Protection in Load Switches 2016年 5月 19日
Application note Quiescent Current vs Shutdown Current for Load Switch Power Consumption 2016年 3月 30日
EVM User's guide TPS22925EVM User's Guide (Rev. A) 2016年 1月 4日
Application note Managing Inrush Current (Rev. A) 2015年 5月 28日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TPS22925EVM — TPS22925EVM 3.6V、3A、9mΩ 負載開關評估模組

The TPS22925EVM evaluation module (EVM) is a fully assembled and tested circuit for evaluating the TPS22925 load switch. TPS22925EVM is a two-sided PCB containing the TPS22925 load switches. The EVM allows the user to apply different input voltages (0.65 V to 3.6 V) under different loading (...)

使用指南: PDF
TI.com 無法提供
開發板

TPS22925NEVM — TPS22925NEVM 3.6V、3A、9mΩ 負載開關評估模組

The TPS22925EVM evaluation module (EVM) is a fully assembled and tested circuit for evaluating the TPS22925N load switch. TPS22925EVM is a two-sided PCB containing the TPS22925 load switches. The EVM allows the user to apply different input voltages (0.65 V to 3.6 V) under different loading (...)

使用指南: PDF
TI.com 無法提供
模擬型號

TPS22925B Unencrypted PSpice Transient Model Package (Rev. A)

SLVMBC2A.ZIP (61 KB) - PSpice Model
模擬型號

TPS22925BN Unencrypted PSpice Transient Model Package (Rev. A)

SLVMBC3A.ZIP (60 KB) - PSpice Model
模擬型號

TPS22925C Unencrypted PSpice Transient Model Package (Rev. A)

SLVMBC4A.ZIP (60 KB) - PSpice Model
模擬型號

TPS22925CN Unencrypted PSpice Transient Model Package (Rev. A)

SLVMBC5A.ZIP (60 KB) - PSpice Model
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
參考設計

TIDA-01366 — 適用於 Altera™ MAX® 10 FPGA 且最高可支援 125°C 工作溫度的小型高效率電源參考設計

TIDA-01366 (also known as PMP9799) was designed for Altera's MAX® 10 FPGA. This reference design uses three DC/DC converters to power the MAX-10 cost-effectively. This design supports numerous industrial applications and any application that requires a small, high efficiency, (...)
Design guide: PDF
電路圖: PDF
封裝 引腳 下載
DSBGA (YPH) 6 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片