>> TI Home > Packaging

 Packaging information for: DBQ
16 Pins | 20 Pins | 24 Pins | 28 Pins
     
Package Selection Guide:
   by Package Type
   by JEDEC Code
   by Package Pitch
   by Package Max Height
   by TI Package Designator
Devices by Package
   Designator
Related Documents
Packaging Terminology

Lead-Free Process Solutions

Other Packages:

 
Package:  DBQ Pins:  16
Description: Plastic Small Outline
Updated: 8/6/2011 (PDF size: 87 K)
Industry Standard Term: SSOP
Width (mm): 3.9
Length (mm): 4.9
Thickness (mm): 1.5
Pitch (mm): .64
Maximum Height (mm): 1.75
JEDEC: R-PDSO-G

Package:  DBQ Pins:  20
Description: Plastic Small Outline
Updated: 8/6/2011 (PDF size: 87 K)
Industry Standard Term: SSOP
Width (mm): 3.9
Length (mm): 8.65
Thickness (mm): 1.5
Pitch (mm): .64
Maximum Height (mm): 1.75
JEDEC: R-PDSO-G

Package:  DBQ Pins:  24
Description: Plastic Small Outline
Updated: 8/6/2011 (PDF size: 87 K)
Industry Standard Term: SSOP
Width (mm): 3.9
Length (mm): 8.65
Thickness (mm): 1.5
Pitch (mm): .64
Maximum Height (mm): 1.75
JEDEC: R-PDSO-G

Package:  DBQ Pins:  28
Description: Plastic Small Outline
Updated: 8/6/2011 (PDF size: 88 K)
Industry Standard Term: SSOP
Width (mm): 3.9
Length (mm): 9.9
Thickness (mm): 1.5
Pitch (mm): .64
Maximum Height (mm): 1.75
JEDEC: R-PDSO-G