Packaging
Reimagine performance, efficiency and system integration through cutting edge packaging technology
Designed to deliver
Our innovative packaging solutions enable customers to distinguish their products through advancements that provide smaller packages sizes, improved reliability and enhanced performance in areas such as power density, isolation and signal integrity. Our extensive portfolio includes thousands of diverse lead-free packaging options, ranging from traditional ceramic and leaded configurations to advanced chip scale packages (QFN, WCSP and DSBGA). These options utilize fine pitch wire bond and flip chip interconnects, along with formats such as System in Package (SiP), modules and stacked or embedded die.
With a long-standing commitment to excellence in research and development, our advanced packaging solutions also take advantage of our robust manufacturing infrastructure. We develop these solutions in close collaboration with our design and operations partners. Leveraging our expertise in packaging development, we are well-equipped to deliver the next generation of innovative solutions that meet our customers' needs now and in the future.
Find packaging information by part number
Use the tools below to find the related data and information available to view or download.
Moisture Sensitivity Level (MSL) defines a product's susceptibility to damage from moisture during reflow ordering
Details include package drawing and footprint-functionality, status, CAD file and STEP model
Details include package information - tape & reel, tube or tray specifications - package name, package type, pins and SPQ
Frequently asked questions
Quality policies & procedures
TI's quality policies and procedures help quickly address and resolve any quality-related issue that could arise, from new product qualifications and process change notices to timely resolution of customer issues and complaints. For answers to questions about TI's quality management system, general quality guidelines (GQG), quality policy manual, change control and product withdrawal/discontinuance policies, click here.
Environmental information
Our objective is to conduct our business in such a way that protects and preserves the environment, health and safety of our employees, customers and the communities where we live and operate. For common questions about TI's material content, environmental compliance, lead-free and conflict material information, click here.
Qualification
The qualification process confirms that the reliability of our prodcuts, processes and packages meets industry standards. All TI products undergo qualification and reliability testing or qualification by similiarity justification prior to release. Common questions about TI's qualification process can be found here.
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